Revealing substrate-coupling strengths of layered materials by using spin angular momentum of light

Yu Chen Chang, Ye Ru Chen, Yu Fan Chiang, Yann Wen Lan, Ting Hua Lu*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution


We study here the amount of helicity exchange of scattered light from the monolayer molybdenum disulfide (MoS2) or graphene on different structures by using spin angular momentum of light in Raman spectroscopy. Our in-house modified Raman spectroscopy setup is used for analyzing the optical helicity by calculating the degree of circular polarization (DoCP) of circularly polarized incident light when scattered from the 2D materials on different substrates. We observe Raman intensity variation when controlling phonon vibration of the 2D materials under the polarized excitation. The experimental results show that the layered materials deposited on SiO2/Si substrates has maximum DoCP as compared to other substrates with different structures. All the findings are analyzed by numerical simulation that incorporate the related Raman tensors and optical Jones calculus, which is worth exploring the phonon-electron interaction.

Original languageEnglish
Title of host publicationComplex Light and Optical Forces XVII
EditorsDavid L. Andrews, Enrique J. Galvez, Halina Rubinsztein-Dunlop
ISBN (Electronic)9781510659773
Publication statusPublished - 2023
EventComplex Light and Optical Forces XVII 2023 - San Francisco, United States
Duration: 2023 Jan 302023 Feb 2

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


ConferenceComplex Light and Optical Forces XVII 2023
Country/TerritoryUnited States
CitySan Francisco


  • 2D materials
  • Graphene
  • Helicity exchange
  • MoS2
  • Phonon
  • Polarized Raman spectroscopy

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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