Abstract
The rapid thermal annealing effects on thin Pt/Y2O3/Si MOS capacitors have been investigated. After post-metallization annealing at 425 °C in 30 s, the Pt/Y2O3/Si capacitor shows a sharp capacitance-voltage swing of a low oxide charge density ∼7.7 × 1010 cm-2 and a minimum interface state density ∼3.6 × 1010 cm-2eV-1. The depth-profiling X-ray photoelectron spectra show the annihilation of O-H bonding, and stabilization of Y-O bonding in the Y2O3 layer by thermal annealing. However, at the interface, a transition silicate layer of Si-Y-O-H bonding is persistent.
Original language | English |
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Pages (from-to) | 1021-1025 |
Number of pages | 5 |
Journal | Solid-State Electronics |
Volume | 47 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2003 Jun |
Externally published | Yes |
Keywords
- Post-metallization annealing
- Si
- XPS
- YO
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry