Prospects for ferroelectric HfZrOx FETs with experimentally CET=0.98nm, SSfor=42mV/dec, SSrev=28mV/dec, switch-off <0.2V, and hysteresis-free strategies

M. H. Lee; P. G. Chen; C. Liu; K. Y. Chu; C. C. Cheng; M. J. Xie; S. N. Liu; J. W. Lee; S. J. Huang; M. H. Liao; M. Tang; K. S. Li; M. C. Chen

doi:10.1109/IEDM.2015.7409759

Prospects for ferroelectric HfZrOx FETs with experimentally CET=0.98nm, SS_for=42mV/dec, SS_rev=28mV/dec, switch-off <0.2V, and hysteresis-free strategies

M. H. Lee
, P. G. Chen
, C. Liu
, K. Y. Chu
, C. C. Cheng
, M. J. Xie
, S. N. Liu
, J. W. Lee
, S. J. Huang
, M. H. Liao
, M. Tang
, K. S. Li
, M. C. Chen

Undergraduate Program of Electro-Optical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

95 Citations (Scopus)

Abstract

Ferroelectric HfZrOx (FE-HZO) FETs is experimentally demonstrated with 0.98nm CET (capacitance equivalent thickness), small hysteresis window V_T (threshold voltage) shift < 0.1V, SS_for = 42mV/dec, SS_rev = 28mV/dec, and switch-off < 0.2V. The optimum ALD process leads single monolayer SiO_x for IL (interfacial layer) and low gate leakage current. The FE-HZO FETs is operated at room temperature and 150K to obtain beyond the physical limitation of Boltzmann tyranny, and the extracted body factors are m = 0.67 and m = 0.89 for Vds = 0.1 and 0.5 V, respectively, to confirm the negative capacitance (NC) effect. There are two proposed strategies to reach hysteresis-free, including FE-HZO/epi-Ge/Si FETs with experimentally VT shift 3mV in hysteresis window, and 3nm-thick FE-HZO resulting hysteresis-free and sub-0.2V switching by numerical simulation.

Original language	English
Title of host publication	2015 IEEE International Electron Devices Meeting, IEDM 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	22.5.1-22.5.4
ISBN (Electronic)	9781467398930
DOIs	https://doi.org/10.1109/IEDM.2015.7409759
Publication status	Published - 2015 Feb 16
Event	61st IEEE International Electron Devices Meeting, IEDM 2015 - Washington, United States Duration: 2015 Dec 7 → 2015 Dec 9

Publication series

Name	Technical Digest - International Electron Devices Meeting, IEDM
Volume	2016-February
ISSN (Print)	0163-1918

Other

Other	61st IEEE International Electron Devices Meeting, IEDM 2015
Country/Territory	United States
City	Washington
Period	2015/12/07 → 2015/12/09

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Access to Document

10.1109/IEDM.2015.7409759

Cite this

Lee, M. H., Chen, P. G., Liu, C., Chu, K. Y., Cheng, C. C., Xie, M. J., Liu, S. N., Lee, J. W., Huang, S. J., Liao, M. H., Tang, M., Li, K. S., & Chen, M. C. (2015). Prospects for ferroelectric HfZrOx FETs with experimentally CET=0.98nm, SS_for=42mV/dec, SS_rev=28mV/dec, switch-off <0.2V, and hysteresis-free strategies. In 2015 IEEE International Electron Devices Meeting, IEDM 2015 (pp. 22.5.1-22.5.4). Article 7409759 (Technical Digest - International Electron Devices Meeting, IEDM; Vol. 2016-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEDM.2015.7409759

Prospects for ferroelectric HfZrOx FETs with experimentally CET=0.98nm, SS_for=42mV/dec, SS_rev=28mV/dec, switch-off <0.2V, and hysteresis-free strategies. / Lee, M. H.; Chen, P. G.; Liu, C. et al.
2015 IEEE International Electron Devices Meeting, IEDM 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 22.5.1-22.5.4 7409759 (Technical Digest - International Electron Devices Meeting, IEDM; Vol. 2016-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lee, MH, Chen, PG, Liu, C, Chu, KY, Cheng, CC, Xie, MJ, Liu, SN, Lee, JW, Huang, SJ, Liao, MH, Tang, M, Li, KS & Chen, MC 2015, Prospects for ferroelectric HfZrOx FETs with experimentally CET=0.98nm, SS_for=42mV/dec, SS_rev=28mV/dec, switch-off <0.2V, and hysteresis-free strategies. in 2015 IEEE International Electron Devices Meeting, IEDM 2015., 7409759, Technical Digest - International Electron Devices Meeting, IEDM, vol. 2016-February, Institute of Electrical and Electronics Engineers Inc., pp. 22.5.1-22.5.4, 61st IEEE International Electron Devices Meeting, IEDM 2015, Washington, United States, 2015/12/07. https://doi.org/10.1109/IEDM.2015.7409759

Lee MH, Chen PG, Liu C, Chu KY, Cheng CC, Xie MJ et al. Prospects for ferroelectric HfZrOx FETs with experimentally CET=0.98nm, SS_for=42mV/dec, SS_rev=28mV/dec, switch-off <0.2V, and hysteresis-free strategies. In 2015 IEEE International Electron Devices Meeting, IEDM 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 22.5.1-22.5.4. 7409759. (Technical Digest - International Electron Devices Meeting, IEDM). doi: 10.1109/IEDM.2015.7409759

Lee, M. H. ; Chen, P. G. ; Liu, C. et al. / Prospects for ferroelectric HfZrOx FETs with experimentally CET=0.98nm, SS_for=42mV/dec, SS_rev=28mV/dec, switch-off <0.2V, and hysteresis-free strategies. 2015 IEEE International Electron Devices Meeting, IEDM 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 22.5.1-22.5.4 (Technical Digest - International Electron Devices Meeting, IEDM).

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title = "Prospects for ferroelectric HfZrOx FETs with experimentally CET=0.98nm, SSfor=42mV/dec, SSrev=28mV/dec, switch-off <0.2V, and hysteresis-free strategies",

abstract = "Ferroelectric HfZrOx (FE-HZO) FETs is experimentally demonstrated with 0.98nm CET (capacitance equivalent thickness), small hysteresis window VT (threshold voltage) shift < 0.1V, SSfor = 42mV/dec, SSrev = 28mV/dec, and switch-off < 0.2V. The optimum ALD process leads single monolayer SiOx for IL (interfacial layer) and low gate leakage current. The FE-HZO FETs is operated at room temperature and 150K to obtain beyond the physical limitation of Boltzmann tyranny, and the extracted body factors are m = 0.67 and m = 0.89 for Vds = 0.1 and 0.5 V, respectively, to confirm the negative capacitance (NC) effect. There are two proposed strategies to reach hysteresis-free, including FE-HZO/epi-Ge/Si FETs with experimentally VT shift 3mV in hysteresis window, and 3nm-thick FE-HZO resulting hysteresis-free and sub-0.2V switching by numerical simulation.",

author = "Lee, \{M. H.\} and Chen, \{P. G.\} and C. Liu and Chu, \{K. Y.\} and Cheng, \{C. C.\} and Xie, \{M. J.\} and Liu, \{S. N.\} and Lee, \{J. W.\} and Huang, \{S. J.\} and Liao, \{M. H.\} and M. Tang and Li, \{K. S.\} and Chen, \{M. C.\}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 61st IEEE International Electron Devices Meeting, IEDM 2015 ; Conference date: 07-12-2015 Through 09-12-2015",

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AU - Lee, J. W.

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AU - Liao, M. H.

AU - Tang, M.

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AB - Ferroelectric HfZrOx (FE-HZO) FETs is experimentally demonstrated with 0.98nm CET (capacitance equivalent thickness), small hysteresis window VT (threshold voltage) shift < 0.1V, SSfor = 42mV/dec, SSrev = 28mV/dec, and switch-off < 0.2V. The optimum ALD process leads single monolayer SiOx for IL (interfacial layer) and low gate leakage current. The FE-HZO FETs is operated at room temperature and 150K to obtain beyond the physical limitation of Boltzmann tyranny, and the extracted body factors are m = 0.67 and m = 0.89 for Vds = 0.1 and 0.5 V, respectively, to confirm the negative capacitance (NC) effect. There are two proposed strategies to reach hysteresis-free, including FE-HZO/epi-Ge/Si FETs with experimentally VT shift 3mV in hysteresis window, and 3nm-thick FE-HZO resulting hysteresis-free and sub-0.2V switching by numerical simulation.

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