Performance of silver-glue attachment technology in assembly

Mu Chun Wang; Kuo Shu Huang; Zhen Ying Hsieh; Hsin Chia Yang; Chuan Hsi Liu; Chii Ruey Lin

doi:10.1109/ICEPT.2010.5583797

Performance of silver-glue attachment technology in assembly

Mu Chun Wang^*, Kuo Shu Huang, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

^*Corresponding author for this work

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxyresin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.

Original language	English
Title of host publication	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages	472-475
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2010.5583797
Publication status	Published - 2010
Event	2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China Duration: 2010 Aug 16 → 2010 Aug 19

Publication series

Name	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other	2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Country/Territory	China
City	Xi'an
Period	2010/08/16 → 2010/08/19

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICEPT.2010.5583797

Cite this

Wang, M. C., Huang, K. S., Hsieh, Z. Y., Yang, H. C., Liu, C. H., & Lin, C. R. (2010). Performance of silver-glue attachment technology in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (pp. 472-475). Article 5583797 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5583797

Performance of silver-glue attachment technology in assembly. / Wang, Mu Chun; Huang, Kuo Shu; Hsieh, Zhen Ying et al.
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 472-475 5583797 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wang, MC, Huang, KS, Hsieh, ZY, Yang, HC, Liu, CH & Lin, CR 2010, Performance of silver-glue attachment technology in assembly. in Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010., 5583797, Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, pp. 472-475, 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, 2010/08/16. https://doi.org/10.1109/ICEPT.2010.5583797

Wang MC, Huang KS, Hsieh ZY, Yang HC, Liu CH, Lin CR. Performance of silver-glue attachment technology in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 472-475. 5583797. (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). doi: 10.1109/ICEPT.2010.5583797

Wang, Mu Chun ; Huang, Kuo Shu ; Hsieh, Zhen Ying et al. / Performance of silver-glue attachment technology in assembly. Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. pp. 472-475 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).

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abstract = "Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxyresin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.",

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Performance of silver-glue attachment technology in assembly

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