Performance of silver-glue attachment technology in assembly

Mu Chun Wang, Kuo Shu Huang, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxyresin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.

Original languageEnglish
Title of host publicationProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages472-475
Number of pages4
DOIs
Publication statusPublished - 2010 Nov 24
Event2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China
Duration: 2010 Aug 162010 Aug 19

Publication series

NameProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
CountryChina
CityXi'an
Period10/8/1610/8/19

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Wang, M. C., Huang, K. S., Hsieh, Z. Y., Yang, H. C., Liu, C. H., & Lin, C. R. (2010). Performance of silver-glue attachment technology in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (pp. 472-475). [5583797] (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5583797