Performance evaluation of a hybrid cooling system for electronic chips

Lung Yue Jeng, Tun Ping Teng*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

35 Citations (Scopus)


This study develops a hybrid cooling system that combines the advantages of a liquid cooling system and a vapor compression refrigeration system (VCRS). This hybrid cooling system uses Al2O3/water nanofluid and hydrocarbon refrigerant as the working liquid and VCRS cooling for the CPU. A heating module was used to simulate the heat of the CPU at different power levels. The surface temperature of the heating module and pumping power consumption under various experimental parameters were measured to assess the performance and feasibility of the hybrid cooling system. Experimental results show that the maximum cooling capacities of the liquid, VCRS, and hybrid cooling systems are 450W, 270W, and 540W, respectively. Using Al2O3/water nanofluid instead of distilled water in liquid cooling system leads to greater heat dissipation performance, greater power consumption for the water pump, and a lower surface temperature on the heater. In addition to cooling electronic chips, the hybrid cooling system can be used in other heat dissipation applications involving high-heat components to increase system performance and extend the lifetime of the apparatus or equipment.

Original languageEnglish
Pages (from-to)155-162
Number of pages8
JournalExperimental Thermal and Fluid Science
Publication statusPublished - 2013 Feb


  • Hybrid cooling system
  • Hydrocarbon refrigerant
  • Liquid cooling system
  • Power consumption
  • Vapor compression refrigeration system (VCRS)

ASJC Scopus subject areas

  • General Chemical Engineering
  • Nuclear Energy and Engineering
  • Aerospace Engineering
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes


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