Parametric Optimization of WEDM Process for Machining ANSI Steel Using Soft-Computing Methods

Yi Zhen Chen*, Hsin Han Chiang, Jo An Liao, Yen Lin Chen, Hsiao Chi Li

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper introduces a parametric method for optimizing the wire electric discharge machining (WEDM) process applied to steel machining. The proposed approach employs soft-computing methods to determine the optimal process parameters for achieving maximum material removal rate and minimum surface roughness. This work conducts an analytical investigation to evaluate the feasibility of the proposed approach.

Original languageEnglish
Title of host publication2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages861-862
Number of pages2
ISBN (Electronic)9798350324174
DOIs
Publication statusPublished - 2023
Externally publishedYes
Event2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Pingtung, Taiwan
Duration: 2023 Jul 172023 Jul 19

Publication series

Name2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings

Conference

Conference2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023
Country/TerritoryTaiwan
CityPingtung
Period2023/07/172023/07/19

Keywords

  • AISI steel
  • model-based optimization
  • soft-computing
  • wire electric discharge machining (WEDM)

ASJC Scopus subject areas

  • Artificial Intelligence
  • Human-Computer Interaction
  • Information Systems
  • Information Systems and Management
  • Electrical and Electronic Engineering
  • Media Technology
  • Instrumentation

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