Package-strain-enhanced device and circuit performance

S. Maikap, M. H. Liao, F. Yuan, M. H. Lee, C. F. Huang, S. T. Chang, C. W. Liu

    Research output: Contribution to journalConference articlepeer-review

    21 Citations (Scopus)

    Fingerprint Dive into the research topics of 'Package-strain-enhanced device and circuit performance'. Together they form a unique fingerprint.

    Chemical Compounds

    Engineering & Materials Science

    Physics & Astronomy