Package-strain-enhanced device and circuit performance

  • S. Maikap
  • , M. H. Liao
  • , F. Yuan
  • , M. H. Lee
  • , C. F. Huang
  • , S. T. Chang
  • , C. W. Liu*
    • *Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

21 Citations (Scopus)

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Engineering