Optimization of solderability for 2.4GHz RF printed-circuit-board products

Mu Chun Wang*, Ting Yu Yang, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The solder technology on printed-circuit-board (PCB) industry is one of key roles to provide the high-yield assembly. In this work, we investigated the soldering temperature impacting the solderability on PCB with PCB layout patterns to optimize the solderability on PCB. The inner copper diameters of solder-pin holes, the space between the exterior contour of the inner core and the interior of the boundless copper, the plural petal patterns of solder points and the width of the petals were taken into concern as well. Indeed, not all of parameters were quantitatively increased, then, the solderability was linearly increased, too. If the soldering temperature is able to be concentrated on the solder point, the solder material is not quickly frozen. Therefore, the surrounding area neighboring the solder point is relatively lower. This result indicates that the solderability quality on PCB is better.

Original languageEnglish
Title of host publicationIMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages227-230
Number of pages4
DOIs
Publication statusPublished - 2009
EventIMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
Duration: 2009 Oct 212009 Oct 23

Publication series

NameIMPACT Conference 2009 International 3D IC Conference - Proceedings

Other

OtherIMPACT Conference 2009 International 3D IC Conference
Country/TerritoryTaiwan
CityTaipei
Period2009/10/212009/10/23

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Fingerprint

Dive into the research topics of 'Optimization of solderability for 2.4GHz RF printed-circuit-board products'. Together they form a unique fingerprint.

Cite this