TY - GEN
T1 - Optimization of solderability for 2.4GHz RF printed-circuit-board products
AU - Wang, Mu Chun
AU - Yang, Ting Yu
AU - Hsieh, Zhen Ying
AU - Yang, Hsin Chia
AU - Liu, Chuan Hsi
AU - Lin, Chii Ruey
PY - 2009
Y1 - 2009
N2 - The solder technology on printed-circuit-board (PCB) industry is one of key roles to provide the high-yield assembly. In this work, we investigated the soldering temperature impacting the solderability on PCB with PCB layout patterns to optimize the solderability on PCB. The inner copper diameters of solder-pin holes, the space between the exterior contour of the inner core and the interior of the boundless copper, the plural petal patterns of solder points and the width of the petals were taken into concern as well. Indeed, not all of parameters were quantitatively increased, then, the solderability was linearly increased, too. If the soldering temperature is able to be concentrated on the solder point, the solder material is not quickly frozen. Therefore, the surrounding area neighboring the solder point is relatively lower. This result indicates that the solderability quality on PCB is better.
AB - The solder technology on printed-circuit-board (PCB) industry is one of key roles to provide the high-yield assembly. In this work, we investigated the soldering temperature impacting the solderability on PCB with PCB layout patterns to optimize the solderability on PCB. The inner copper diameters of solder-pin holes, the space between the exterior contour of the inner core and the interior of the boundless copper, the plural petal patterns of solder points and the width of the petals were taken into concern as well. Indeed, not all of parameters were quantitatively increased, then, the solderability was linearly increased, too. If the soldering temperature is able to be concentrated on the solder point, the solder material is not quickly frozen. Therefore, the surrounding area neighboring the solder point is relatively lower. This result indicates that the solderability quality on PCB is better.
UR - http://www.scopus.com/inward/record.url?scp=77950801482&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77950801482&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2009.5382133
DO - 10.1109/IMPACT.2009.5382133
M3 - Conference contribution
AN - SCOPUS:77950801482
SN - 9781424443413
T3 - IMPACT Conference 2009 International 3D IC Conference - Proceedings
SP - 227
EP - 230
BT - IMPACT Conference 2009 International 3D IC Conference - Proceedings
T2 - IMPACT Conference 2009 International 3D IC Conference
Y2 - 21 October 2009 through 23 October 2009
ER -