Optimization of solderability for 2.4GHz RF printed-circuit-board products

Mu Chun Wang; Ting Yu Yang; Zhen Ying Hsieh; Hsin Chia Yang; Chuan Hsi Liu; Chii Ruey Lin

doi:10.1109/IMPACT.2009.5382133

Optimization of solderability for 2.4GHz RF printed-circuit-board products

Mu Chun Wang, Ting Yu Yang, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

Department of Mechartronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The solder technology on printed-circuit-board (PCB) industry is one of key roles to provide the high-yield assembly. In this work, we investigated the soldering temperature impacting the solderability on PCB with PCB layout patterns to optimize the solderability on PCB. The inner copper diameters of solder-pin holes, the space between the exterior contour of the inner core and the interior of the boundless copper, the plural petal patterns of solder points and the width of the petals were taken into concern as well. Indeed, not all of parameters were quantitatively increased, then, the solderability was linearly increased, too. If the soldering temperature is able to be concentrated on the solder point, the solder material is not quickly frozen. Therefore, the surrounding area neighboring the solder point is relatively lower. This result indicates that the solderability quality on PCB is better.

Original language	English
Title of host publication	IMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages	227-230
Number of pages	4
DOIs	https://doi.org/10.1109/IMPACT.2009.5382133
Publication status	Published - 2009 Dec 1
Event	IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan Duration: 2009 Oct 21 → 2009 Oct 23

Other

Other	IMPACT Conference 2009 International 3D IC Conference
Country	Taiwan
City	Taipei
Period	09/10/21 → 09/10/23

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

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10.1109/IMPACT.2009.5382133

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Cite this

@inproceedings{0f5b82b820df415c9928e9ed7ec5210c,

title = "Optimization of solderability for 2.4GHz RF printed-circuit-board products",

abstract = "The solder technology on printed-circuit-board (PCB) industry is one of key roles to provide the high-yield assembly. In this work, we investigated the soldering temperature impacting the solderability on PCB with PCB layout patterns to optimize the solderability on PCB. The inner copper diameters of solder-pin holes, the space between the exterior contour of the inner core and the interior of the boundless copper, the plural petal patterns of solder points and the width of the petals were taken into concern as well. Indeed, not all of parameters were quantitatively increased, then, the solderability was linearly increased, too. If the soldering temperature is able to be concentrated on the solder point, the solder material is not quickly frozen. Therefore, the surrounding area neighboring the solder point is relatively lower. This result indicates that the solderability quality on PCB is better.",

author = "Wang, {Mu Chun} and Yang, {Ting Yu} and Hsieh, {Zhen Ying} and Yang, {Hsin Chia} and Liu, {Chuan Hsi} and Lin, {Chii Ruey}",

year = "2009",

month = dec,

day = "1",

doi = "10.1109/IMPACT.2009.5382133",

language = "English",

isbn = "9781424443413",

pages = "227--230",

booktitle = "IMPACT Conference 2009 International 3D IC Conference - Proceedings",

note = "IMPACT Conference 2009 International 3D IC Conference ; Conference date: 21-10-2009 Through 23-10-2009",

}

TY - GEN

T1 - Optimization of solderability for 2.4GHz RF printed-circuit-board products

AU - Wang, Mu Chun

AU - Yang, Ting Yu

AU - Hsieh, Zhen Ying

AU - Yang, Hsin Chia

AU - Liu, Chuan Hsi

AU - Lin, Chii Ruey

PY - 2009/12/1

Y1 - 2009/12/1

N2 - The solder technology on printed-circuit-board (PCB) industry is one of key roles to provide the high-yield assembly. In this work, we investigated the soldering temperature impacting the solderability on PCB with PCB layout patterns to optimize the solderability on PCB. The inner copper diameters of solder-pin holes, the space between the exterior contour of the inner core and the interior of the boundless copper, the plural petal patterns of solder points and the width of the petals were taken into concern as well. Indeed, not all of parameters were quantitatively increased, then, the solderability was linearly increased, too. If the soldering temperature is able to be concentrated on the solder point, the solder material is not quickly frozen. Therefore, the surrounding area neighboring the solder point is relatively lower. This result indicates that the solderability quality on PCB is better.

AB - The solder technology on printed-circuit-board (PCB) industry is one of key roles to provide the high-yield assembly. In this work, we investigated the soldering temperature impacting the solderability on PCB with PCB layout patterns to optimize the solderability on PCB. The inner copper diameters of solder-pin holes, the space between the exterior contour of the inner core and the interior of the boundless copper, the plural petal patterns of solder points and the width of the petals were taken into concern as well. Indeed, not all of parameters were quantitatively increased, then, the solderability was linearly increased, too. If the soldering temperature is able to be concentrated on the solder point, the solder material is not quickly frozen. Therefore, the surrounding area neighboring the solder point is relatively lower. This result indicates that the solderability quality on PCB is better.

UR - http://www.scopus.com/inward/record.url?scp=77950801482&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77950801482&partnerID=8YFLogxK

U2 - 10.1109/IMPACT.2009.5382133

DO - 10.1109/IMPACT.2009.5382133

M3 - Conference contribution

AN - SCOPUS:77950801482

SN - 9781424443413

SP - 227

EP - 230

BT - IMPACT Conference 2009 International 3D IC Conference - Proceedings

T2 - IMPACT Conference 2009 International 3D IC Conference

Y2 - 21 October 2009 through 23 October 2009

ER -