Optimization of solderability for 2.4GHz RF printed-circuit-board products

Mu Chun Wang, Ting Yu Yang, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution


The solder technology on printed-circuit-board (PCB) industry is one of key roles to provide the high-yield assembly. In this work, we investigated the soldering temperature impacting the solderability on PCB with PCB layout patterns to optimize the solderability on PCB. The inner copper diameters of solder-pin holes, the space between the exterior contour of the inner core and the interior of the boundless copper, the plural petal patterns of solder points and the width of the petals were taken into concern as well. Indeed, not all of parameters were quantitatively increased, then, the solderability was linearly increased, too. If the soldering temperature is able to be concentrated on the solder point, the solder material is not quickly frozen. Therefore, the surrounding area neighboring the solder point is relatively lower. This result indicates that the solderability quality on PCB is better.

Original languageEnglish
Title of host publicationIMPACT Conference 2009 International 3D IC Conference - Proceedings
Number of pages4
Publication statusPublished - 2009 Dec 1
EventIMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
Duration: 2009 Oct 212009 Oct 23


OtherIMPACT Conference 2009 International 3D IC Conference

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials


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