@inproceedings{d36809240ae547c9b04024839ec47f6b,
title = "Novel T shape structure PCM and electrical-thermal characteristics",
abstract = "Novel interfacial layer structure was proposed with adjustable resistance ratio and more uniform data distribution capabilities. The reduction of writing power can also be expected with further optimizing the materials and corresponding thicknesses. The performance will be even better with the shrinking of contact area.",
author = "Wang, {W. H.} and Chao, {D. S.} and Chen, {Y. C.} and Lee, {C. M.} and Hsu, {H. H.} and Y. Chuo and Tseng, {M. H.} and Lee, {M. H.} and Chen, {W. S.} and Kao, {M. J.} and Tsai, {M. J.}",
year = "2006",
doi = "10.1109/VTSA.2006.251057",
language = "English",
isbn = "142440181X",
series = "International Symposium on VLSI Technology, Systems, and Applications, Proceedings",
pages = "40--41",
booktitle = "2006 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA - Proceedings of Technical Papers",
note = "2006 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA ; Conference date: 24-04-2006 Through 26-04-2006",
}