Novel positive-tone thick photoresist for high aspect ratio microsystem technology

G. W. Hsieh, Y. S. Hsieh, C. R. Yang, Y. D. Lee

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

A methacrylate copolymer combining chemically amplified concept and casting technique was developed as a novel thick photoresist for the UV-LIGA process. Photoresist layers up to 500 μm in thickness can be fabricated easily. Microstructures fabricated by the novel thick photoresist were demonstrated. At present, the ring-shape microstructures with 150 μm tall and 15 μm wide have been realized and the calculated aspect ratio is 10.

Original languageEnglish
Pages (from-to)326-329
Number of pages4
JournalMicrosystem Technologies
Volume8
Issue number4-5
DOIs
Publication statusPublished - 2002 Aug 1

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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