Abstract
A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.
Original language | English |
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Pages (from-to) | 4205-4210 |
Number of pages | 6 |
Journal | Applied Optics |
Volume | 44 |
Issue number | 20 |
DOIs | |
Publication status | Published - 2005 Jul 10 |
Externally published | Yes |
ASJC Scopus subject areas
- Atomic and Molecular Physics, and Optics
- Engineering (miscellaneous)
- Electrical and Electronic Engineering