Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique

Wen Kai Kuo*, Deng Tzung Tang, Chien Jang Wu, Thomson Lai

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.

Original languageEnglish
Pages (from-to)4205-4210
Number of pages6
JournalApplied Optics
Volume44
Issue number20
DOIs
Publication statusPublished - 2005 Jul 10
Externally publishedYes

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Engineering (miscellaneous)
  • Electrical and Electronic Engineering

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