Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique

Wen Kai Kuo, Deng Tzung Tang, Chien-Jang Wu, Thomson Lai

    Research output: Contribution to journalArticle

    2 Citations (Scopus)

    Abstract

    A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.

    Original languageEnglish
    Pages (from-to)4205-4210
    Number of pages6
    JournalApplied Optics
    Volume44
    Issue number20
    DOIs
    Publication statusPublished - 2005 Jul 10

    Fingerprint

    electro-optics
    balls
    grids
    spatial resolution
    probes
    high resolution
    crystals

    ASJC Scopus subject areas

    • Atomic and Molecular Physics, and Optics

    Cite this

    Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique. / Kuo, Wen Kai; Tang, Deng Tzung; Wu, Chien-Jang; Lai, Thomson.

    In: Applied Optics, Vol. 44, No. 20, 10.07.2005, p. 4205-4210.

    Research output: Contribution to journalArticle

    Kuo, Wen Kai ; Tang, Deng Tzung ; Wu, Chien-Jang ; Lai, Thomson. / Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique. In: Applied Optics. 2005 ; Vol. 44, No. 20. pp. 4205-4210.
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