New electrically conducting materials based on the dmit ligand

A. E. Pullen*, K. A. Abboud, J. R. Reynolds, J. Piotraschke, S. Zeltner, R. M. Olk, E. Hoyer, Hsiang Lin Liu, D. B. Tanner

*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

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