Nanotribological behavior of ZnO films prepared by atomic layer deposition

Wun Kai Wang, Hua Chiang Wen, Chun Hu Cheng, Wu Ching Chou, Wei Hung Yau, Ching Hua Hung, Chang Pin Chou

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

We used atomic layer deposition to form ZnO thin-film coatings on Si substrates and then evaluate the effect of pile-up using the nanoscratch technique under a ramped mode. The wear volume decreased with increasing annealing temperature from room temperature to 400 C for a given load. Elastic-to-plastic deformation occurred during sliding scratch processing between the groove and film for loading penetration of 30 nm. The onset of non-elastic behavior and greater contact pressure were evident for loading penetration of 150 nm; thus, full plastic deformation occurred as a result of a substrate effect. We suspect that elastic-plastic failure events were related to edge bulging between the groove and film, with elastic-plastic deformation attributable to adhesion discontinuities and/or cohesion failure of the ZnO films.

Original languageEnglish
Pages (from-to)334-338
Number of pages5
JournalJournal of Physics and Chemistry of Solids
Volume75
Issue number3
DOIs
Publication statusPublished - 2014 Mar 1

Fingerprint

Atomic layer deposition
atomic layer epitaxy
plastic deformation
Plastic deformation
grooves
penetration
bulging
cohesion
elastic deformation
Elastic deformation
Substrates
piles
Piles
sliding
discontinuity
adhesion
Adhesion
plastics
Wear of materials
Annealing

Keywords

  • A. Thin films
  • B. Vapor deposition
  • C. Mechanical properties

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Nanotribological behavior of ZnO films prepared by atomic layer deposition. / Wang, Wun Kai; Wen, Hua Chiang; Cheng, Chun Hu; Chou, Wu Ching; Yau, Wei Hung; Hung, Ching Hua; Chou, Chang Pin.

In: Journal of Physics and Chemistry of Solids, Vol. 75, No. 3, 01.03.2014, p. 334-338.

Research output: Contribution to journalArticle

Wang, Wun Kai ; Wen, Hua Chiang ; Cheng, Chun Hu ; Chou, Wu Ching ; Yau, Wei Hung ; Hung, Ching Hua ; Chou, Chang Pin. / Nanotribological behavior of ZnO films prepared by atomic layer deposition. In: Journal of Physics and Chemistry of Solids. 2014 ; Vol. 75, No. 3. pp. 334-338.
@article{6580cfd53b564acdab6946c160e25a3c,
title = "Nanotribological behavior of ZnO films prepared by atomic layer deposition",
abstract = "We used atomic layer deposition to form ZnO thin-film coatings on Si substrates and then evaluate the effect of pile-up using the nanoscratch technique under a ramped mode. The wear volume decreased with increasing annealing temperature from room temperature to 400 C for a given load. Elastic-to-plastic deformation occurred during sliding scratch processing between the groove and film for loading penetration of 30 nm. The onset of non-elastic behavior and greater contact pressure were evident for loading penetration of 150 nm; thus, full plastic deformation occurred as a result of a substrate effect. We suspect that elastic-plastic failure events were related to edge bulging between the groove and film, with elastic-plastic deformation attributable to adhesion discontinuities and/or cohesion failure of the ZnO films.",
keywords = "A. Thin films, B. Vapor deposition, C. Mechanical properties",
author = "Wang, {Wun Kai} and Wen, {Hua Chiang} and Cheng, {Chun Hu} and Chou, {Wu Ching} and Yau, {Wei Hung} and Hung, {Ching Hua} and Chou, {Chang Pin}",
year = "2014",
month = "3",
day = "1",
doi = "10.1016/j.jpcs.2013.09.016",
language = "English",
volume = "75",
pages = "334--338",
journal = "Journal of Physics and Chemistry of Solids",
issn = "0022-3697",
publisher = "Elsevier Limited",
number = "3",

}

TY - JOUR

T1 - Nanotribological behavior of ZnO films prepared by atomic layer deposition

AU - Wang, Wun Kai

AU - Wen, Hua Chiang

AU - Cheng, Chun Hu

AU - Chou, Wu Ching

AU - Yau, Wei Hung

AU - Hung, Ching Hua

AU - Chou, Chang Pin

PY - 2014/3/1

Y1 - 2014/3/1

N2 - We used atomic layer deposition to form ZnO thin-film coatings on Si substrates and then evaluate the effect of pile-up using the nanoscratch technique under a ramped mode. The wear volume decreased with increasing annealing temperature from room temperature to 400 C for a given load. Elastic-to-plastic deformation occurred during sliding scratch processing between the groove and film for loading penetration of 30 nm. The onset of non-elastic behavior and greater contact pressure were evident for loading penetration of 150 nm; thus, full plastic deformation occurred as a result of a substrate effect. We suspect that elastic-plastic failure events were related to edge bulging between the groove and film, with elastic-plastic deformation attributable to adhesion discontinuities and/or cohesion failure of the ZnO films.

AB - We used atomic layer deposition to form ZnO thin-film coatings on Si substrates and then evaluate the effect of pile-up using the nanoscratch technique under a ramped mode. The wear volume decreased with increasing annealing temperature from room temperature to 400 C for a given load. Elastic-to-plastic deformation occurred during sliding scratch processing between the groove and film for loading penetration of 30 nm. The onset of non-elastic behavior and greater contact pressure were evident for loading penetration of 150 nm; thus, full plastic deformation occurred as a result of a substrate effect. We suspect that elastic-plastic failure events were related to edge bulging between the groove and film, with elastic-plastic deformation attributable to adhesion discontinuities and/or cohesion failure of the ZnO films.

KW - A. Thin films

KW - B. Vapor deposition

KW - C. Mechanical properties

UR - http://www.scopus.com/inward/record.url?scp=84891626130&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84891626130&partnerID=8YFLogxK

U2 - 10.1016/j.jpcs.2013.09.016

DO - 10.1016/j.jpcs.2013.09.016

M3 - Article

AN - SCOPUS:84891626130

VL - 75

SP - 334

EP - 338

JO - Journal of Physics and Chemistry of Solids

JF - Journal of Physics and Chemistry of Solids

SN - 0022-3697

IS - 3

ER -