Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies

Bo Zhou Liao, Liang Hsi Chen, Kai Cheng Chen, Hong Yi Lin, Yi Ting Tsai, Ting Wei Chen, Yi Cheng Chan, Min Hung Lee, Ming Han Liao*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Engineering & Materials Science

Chemical Compounds