@inproceedings{e7a4323bc9a34ef2896be4f2ccfe0037,
title = "Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies",
abstract = "In this work, carbon nanotubes (CNTs) are grown as advanced filler materials in through-silicon via (TSV). Electrical and thermal properties of CNTs are extracted by experiments and the implementation of multi-layer stacking is proposed. The resistance and thermal conductivity of CNT are measured as 10.5 ohm and 49 W/mK respectively. In accordance with its superior properties over copper, Carbon nanotubes as TSVs (CNT-TSV) have several advantages in three-dimensional integrated circuit (3DIC) technology. Signal integrity index, namely return loss and insertion loss have been evaluated by ANSYS HFSS (High frequency Structure Simulator). Within the high frequency interval (10~20 GHz), CNT-TSV has better electrical characteristics than copper. In summary, CNTs can be a promising material used in future chip on wafer stacking process.",
keywords = "3DIC, CNT, TSV, signal integrity, thermal conductivity",
author = "Liao, {Bo Zhou} and Chen, {Liang Hsi} and Chen, {Kai Cheng} and Lin, {Hong Yi} and Tsai, {Yi Ting} and Chen, {Ting Wei} and Chan, {Yi Cheng} and Lee, {Min Hung} and Liao, {Ming Han}",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 72nd IEEE Electronic Components and Technology Conference, ECTC 2022 ; Conference date: 31-05-2022 Through 03-06-2022",
year = "2022",
doi = "10.1109/ECTC51906.2022.00285",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1811--1817",
booktitle = "Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022",
}