Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies

Bo Zhou Liao, Liang Hsi Chen, Kai Cheng Chen, Hong Yi Lin, Yi Ting Tsai, Ting Wei Chen, Yi Cheng Chan, Min Hung Lee, Ming Han Liao*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, carbon nanotubes (CNTs) are grown as advanced filler materials in through-silicon via (TSV). Electrical and thermal properties of CNTs are extracted by experiments and the implementation of multi-layer stacking is proposed. The resistance and thermal conductivity of CNT are measured as 10.5 ohm and 49 W/mK respectively. In accordance with its superior properties over copper, Carbon nanotubes as TSVs (CNT-TSV) have several advantages in three-dimensional integrated circuit (3DIC) technology. Signal integrity index, namely return loss and insertion loss have been evaluated by ANSYS HFSS (High frequency Structure Simulator). Within the high frequency interval (10~20 GHz), CNT-TSV has better electrical characteristics than copper. In summary, CNTs can be a promising material used in future chip on wafer stacking process.

Original languageEnglish
Title of host publicationProceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1811-1817
Number of pages7
ISBN (Electronic)9781665479431
DOIs
Publication statusPublished - 2022
Event72nd IEEE Electronic Components and Technology Conference, ECTC 2022 - San Diego, United States
Duration: 2022 May 312022 Jun 3

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2022-May
ISSN (Print)0569-5503

Conference

Conference72nd IEEE Electronic Components and Technology Conference, ECTC 2022
Country/TerritoryUnited States
CitySan Diego
Period2022/05/312022/06/03

Keywords

  • 3DIC
  • CNT
  • signal integrity
  • thermal conductivity
  • TSV

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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