MMICs in the millimeter-wave regime

Huei Wang; Kun You Lin; Zuo Min Tsai; Liang Hung Lu; Hsin Chia Lu; Chi Hsueh Wang; Jeng Han Tsai; Tian Wei Huang; Yi Cheng Lin

doi:10.1109/MMM.2008.930676

MMICs in the millimeter-wave regime

Huei Wang^*, Kun You Lin, Zuo Min Tsai, Liang Hung Lu, Hsin Chia Lu, Chi Hsueh Wang, Jeng Han Tsai, Tian Wei Huang, Yi Cheng Lin

^*Corresponding author for this work

Research output: Contribution to specialist publication › Article

48 Citations (Scopus)

Abstract

The future trends of compound semiconductor and silicon-based millimeter-wave monolithic microwave integrated circuits (MMICs) and millimeter-wave system on chip (SOC), are discussed. The use of millimeter-wave MMICs has been increased for commercial applications including communications and automotive radar. The system in package (SIP) technology involves optimal combinations of the components for the best performance in a system. The SIP also requires that the circuit of the system can be implemented in different technologies and integrated into a single package. SOC technology involves that all radio-frequency front-end, analog, mixed-signal, and digital circuits need to be integrated on a single chip. GaAs and InP MMICs can be used to achieve excellent noise or power performance in the transceiver. Researchers are making efforts to develop millimeter wave SOC with base-band circuitry including digital, analog, or mixed-mode circuits.

Original language	English
Pages	99-117
Number of pages	19
Volume	10
No.	1
Specialist publication	IEEE Microwave Magazine
DOIs	https://doi.org/10.1109/MMM.2008.930676
Publication status	Published - 2009 Feb
Externally published	Yes

ASJC Scopus subject areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/MMM.2008.930676

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@misc{b5914c3063fe49dfa1a1cc0665a2d7de,

title = "MMICs in the millimeter-wave regime",

abstract = "The future trends of compound semiconductor and silicon-based millimeter-wave monolithic microwave integrated circuits (MMICs) and millimeter-wave system on chip (SOC), are discussed. The use of millimeter-wave MMICs has been increased for commercial applications including communications and automotive radar. The system in package (SIP) technology involves optimal combinations of the components for the best performance in a system. The SIP also requires that the circuit of the system can be implemented in different technologies and integrated into a single package. SOC technology involves that all radio-frequency front-end, analog, mixed-signal, and digital circuits need to be integrated on a single chip. GaAs and InP MMICs can be used to achieve excellent noise or power performance in the transceiver. Researchers are making efforts to develop millimeter wave SOC with base-band circuitry including digital, analog, or mixed-mode circuits.",

author = "Huei Wang and Lin, {Kun You} and Tsai, {Zuo Min} and Lu, {Liang Hung} and Lu, {Hsin Chia} and Wang, {Chi Hsueh} and Tsai, {Jeng Han} and Huang, {Tian Wei} and Lin, {Yi Cheng}",

year = "2009",

month = feb,

doi = "10.1109/MMM.2008.930676",

language = "English",

volume = "10",

pages = "99--117",

journal = "IEEE Microwave Magazine",

issn = "1527-3342",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - MMICs in the millimeter-wave regime

AU - Wang, Huei

AU - Lin, Kun You

AU - Tsai, Zuo Min

AU - Lu, Liang Hung

AU - Lu, Hsin Chia

AU - Wang, Chi Hsueh

AU - Tsai, Jeng Han

AU - Huang, Tian Wei

AU - Lin, Yi Cheng

PY - 2009/2

Y1 - 2009/2

N2 - The future trends of compound semiconductor and silicon-based millimeter-wave monolithic microwave integrated circuits (MMICs) and millimeter-wave system on chip (SOC), are discussed. The use of millimeter-wave MMICs has been increased for commercial applications including communications and automotive radar. The system in package (SIP) technology involves optimal combinations of the components for the best performance in a system. The SIP also requires that the circuit of the system can be implemented in different technologies and integrated into a single package. SOC technology involves that all radio-frequency front-end, analog, mixed-signal, and digital circuits need to be integrated on a single chip. GaAs and InP MMICs can be used to achieve excellent noise or power performance in the transceiver. Researchers are making efforts to develop millimeter wave SOC with base-band circuitry including digital, analog, or mixed-mode circuits.

AB - The future trends of compound semiconductor and silicon-based millimeter-wave monolithic microwave integrated circuits (MMICs) and millimeter-wave system on chip (SOC), are discussed. The use of millimeter-wave MMICs has been increased for commercial applications including communications and automotive radar. The system in package (SIP) technology involves optimal combinations of the components for the best performance in a system. The SIP also requires that the circuit of the system can be implemented in different technologies and integrated into a single package. SOC technology involves that all radio-frequency front-end, analog, mixed-signal, and digital circuits need to be integrated on a single chip. GaAs and InP MMICs can be used to achieve excellent noise or power performance in the transceiver. Researchers are making efforts to develop millimeter wave SOC with base-band circuitry including digital, analog, or mixed-mode circuits.

UR - http://www.scopus.com/inward/record.url?scp=59149099182&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=59149099182&partnerID=8YFLogxK

U2 - 10.1109/MMM.2008.930676

DO - 10.1109/MMM.2008.930676

M3 - Article

AN - SCOPUS:59149099182

SN - 1527-3342

VL - 10

SP - 99

EP - 117

JO - IEEE Microwave Magazine

JF - IEEE Microwave Magazine

ER -

MMICs in the millimeter-wave regime

Abstract

ASJC Scopus subject areas

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