MeV Al+ and Al2+ ions implantation in Si(100): surface roughness and defects in the bulk

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Abstract

This paper deals with the implantation of high-energy (1.0-3.0 MeV) atomic and molecular Al+ ions in Si(100) to a fluence of 5 × 1014 Al atoms/cm2 at room temperature. The molecular effect, i.e. the increase of the displacement yield compared with the sum of the atomic yields, and the damage formation as well as defect behaviour after annealing have been investigated. A detailed experimental study has been made of the evolution of extended secondary defects which form during thermal anneals of Al+ or Al2+ irradiated silicon. The samples have been examined using combined Rutherford backscattering and channeling experiments together with transmission electron microscopy observations. The surface structure of the implanted wafers has been measured by atomic force microscopy. The results for the implantation-induced roughness at the Si surface, resulting from Al+ or Al2+ irradiation at the same energy/atom, total atomic fluence, flux rate, and irradiation temperature, are presented and discussed.

Original languageEnglish
Pages (from-to)443-448
Number of pages6
JournalApplied Physics A: Materials Science and Processing
Volume70
Issue number4
DOIs
Publication statusPublished - 2000 Apr 1

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Surface defects
Ion implantation
Surface roughness
Irradiation
Atoms
Defects
Rutherford backscattering spectroscopy
Silicon
Surface structure
Atomic force microscopy
Annealing
Ions
Fluxes
Transmission electron microscopy
Temperature
Experiments
Hot Temperature

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)

Cite this

MeV Al+ and Al2+ ions implantation in Si(100) : surface roughness and defects in the bulk. / Kuri, G.; Yang, Tzuen-Rong.

In: Applied Physics A: Materials Science and Processing, Vol. 70, No. 4, 01.04.2000, p. 443-448.

Research output: Contribution to journalArticle

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