Metal deposition on flexible membrane through the combination of localized electrochemical deposition and electroless plating

Meng Chi Huang, Tien-Li Chang, Tune Hune Kao, Chien Chung Fu

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

In this paper, we combined localized electrochemical deposition and electroless plating process for fabricating the metal pattern with the large area on flexible membrane. The pattern of the anode plate can rapidly transfer to the cathode membrane by localized electrochemical deposition. The thickness of the pattern can be increased by electroless plating process. The width of the mask pattern was close to the width of the final pattern. The anode plate can be used over fifty times for this process until the pattern was electrolyzed completely. This method provides a possible low cost approach to fabricate high metal structures on the flexible substrate with large area. It may have the potential to be applied in the fabrication of e-paper, flexible printed circuit and eventually adapted to roll-to-roll process.

Original languageEnglish
Pages (from-to)455-460
Number of pages6
JournalMicrosystem Technologies
Volume19
Issue number3
DOIs
Publication statusPublished - 2013 Jan 1

Fingerprint

Electroless plating
plating
Anodes
Metals
membranes
Membranes
Printed circuits
metals
Masks
Cathodes
Fabrication
anodes
Substrates
Costs
printed circuits
masks
cathodes
fabrication

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Metal deposition on flexible membrane through the combination of localized electrochemical deposition and electroless plating. / Huang, Meng Chi; Chang, Tien-Li; Kao, Tune Hune; Fu, Chien Chung.

In: Microsystem Technologies, Vol. 19, No. 3, 01.01.2013, p. 455-460.

Research output: Contribution to journalArticle

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