Abstract
Double remnant polarization (2Pr values are increased significantly from 17.1μC/cm2 to 39.9μC/cm2 by reducing the TiNx interfacial capping layer (ICL) thickness from 3 nm to 1 nm in the Ru/TiNx/Hf0.5 Zr0.5O2(HZO)/TiN structure owing to lower monoclinic (m) phase with respect to orthorhombic (o) plus rhombohedral (r) phases. These phases are observed by geometrical phase analysis (GPA) of high-resolution transmission electron microscope (HRTEM) images. An optimized 2 nm TiNx ICL ferroelectric memory shows lowest fatigue and mechanism is higher m-phase starting to grow from the HZO/TiN BE interface, which is evidenced in the HRTEM image after long endurance of 1011 cycles under high ±4 MV/cm, 0.5μs (remaining higher 2Pr value of 20μC/cm2).
| Original language | English |
|---|---|
| Pages (from-to) | 673-676 |
| Number of pages | 4 |
| Journal | IEEE Electron Device Letters |
| Volume | 45 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2024 Apr 1 |
| Externally published | Yes |
Keywords
- fatigue mechanism
- ferroelectric memory
- furnace annealing
- long endurance
- scavenged-Ru based electrode
- TiNinterfacial capping layer
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
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