Abstract
We investigated an N-type III–V FinFET with a 25-nm In0.53Ga0.47As channel and a 300-nm In0.52Al0.48As barrier layer on an InP substrate. The In0.52Al0.48As barrier layer is used to suppress leakage current from the InP substrate and the 10-nm Al2O3 film deposited by atomic layer deposition (ALD) can be a robust gate dielectric to mitigate interface traps. The on to off current ratio is approximately three orders of magnitude, the subthreshold swing (SS) is 350 mV/dec, and the maximum driving current density is 130 μA/μm at VG = 1.5 V for InGaAs FinFET with a fin width of 40 nm and gate length of 200 nm.
| Original language | English |
|---|---|
| Pages (from-to) | Q58-Q62 |
| Journal | ECS Journal of Solid State Science and Technology |
| Volume | 6 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2017 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
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