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Investigation of electrical characteristics on 25-nm InGaAs channel FinFET Using InAlAs back barrier and Al2O3 gate dielectric

  • M. H. Lin
  • , Y. C. Lin
  • , Y. S. Lin
  • , W. J. Sun
  • , S. H. Chen
  • , Y. C. Chiu
  • , C. H. Cheng
  • , C. Y. Chang

Research output: Contribution to journalArticlepeer-review

Abstract

We investigated an N-type III–V FinFET with a 25-nm In0.53Ga0.47As channel and a 300-nm In0.52Al0.48As barrier layer on an InP substrate. The In0.52Al0.48As barrier layer is used to suppress leakage current from the InP substrate and the 10-nm Al2O3 film deposited by atomic layer deposition (ALD) can be a robust gate dielectric to mitigate interface traps. The on to off current ratio is approximately three orders of magnitude, the subthreshold swing (SS) is 350 mV/dec, and the maximum driving current density is 130 μA/μm at VG = 1.5 V for InGaAs FinFET with a fin width of 40 nm and gate length of 200 nm.

Original languageEnglish
Pages (from-to)Q58-Q62
JournalECS Journal of Solid State Science and Technology
Volume6
Issue number4
DOIs
Publication statusPublished - 2017

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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