Identifying professional competencies of the flip-chip packaging engineer in Taiwan

Y. H. Guu*, Kuen Yi Lin, Lung Sheng Lee

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


This study employed a literature review, expert interviews, and a questionnaire survey to construct a set of twotier competencies for a flip-chip packaging engineer. The fuzzy Delphi questionnaire was sent to 12 flip-chip engineering experts to identify professional competencies that a flip-chip packaging engineer must have. Four competencies, including flip-chip technology, bumping process, stress analysis, and reliability testing, and their subordinate 15 competency indicators were developed. The results serve as a reference for designing or assessing curricula or programs for preparing a quality flip-chip packaging engineer and to be used as a guideline to recruit and select a flip-chip packaging engineer.

Original languageEnglish
Pages (from-to)61-70
Number of pages10
JournalTurkish Online Journal of Educational Technology
Issue number4
Publication statusPublished - 2014 Oct 1


  • Flip-chip
  • Fuzzy Delphi
  • Packaging engineer
  • Professional competency

ASJC Scopus subject areas

  • Education


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