Identifying professional competencies of the flip-chip packaging engineer in Taiwan

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This study employed a literature review, expert interviews, and a questionnaire survey to construct a set of twotier competencies for a flip-chip packaging engineer. The fuzzy Delphi questionnaire was sent to 12 flip-chip engineering experts to identify professional competencies that a flip-chip packaging engineer must have. Four competencies, including flip-chip technology, bumping process, stress analysis, and reliability testing, and their subordinate 15 competency indicators were developed. The results serve as a reference for designing or assessing curricula or programs for preparing a quality flip-chip packaging engineer and to be used as a guideline to recruit and select a flip-chip packaging engineer.

Original languageEnglish
Pages (from-to)61-70
Number of pages10
JournalTurkish Online Journal of Educational Technology
Volume13
Issue number4
Publication statusPublished - 2014 Oct 1

Fingerprint

engineer
Taiwan
expert
questionnaire
engineering
curriculum
interview

Keywords

  • Flip-chip
  • Fuzzy Delphi
  • Packaging engineer
  • Professional competency

ASJC Scopus subject areas

  • Education

Cite this

Identifying professional competencies of the flip-chip packaging engineer in Taiwan. / Guu, Y. H.; Lin, Kuen Yi; Lee, Lung Sheng.

In: Turkish Online Journal of Educational Technology, Vol. 13, No. 4, 01.10.2014, p. 61-70.

Research output: Contribution to journalArticle

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