Abstract
A new apparatus for a moving induction heating and gas-assisted hot embossing apparatus has been developed. A mechanism was designed and implemented to move the platform in and out the wrapped coil, on which the sealed box for substrate/mold was placed. A chamber of 195 mm diameter and 221 mm length was machined. The movable platform, the sealed box with substrate/mold stack, wrapped coil and cooling fan were all implemented in the high pressure chamber. The nine-point thermocouples attached on the mold, thus, a temperature history of the moving induction heating can be obtained and study the influence of the moving path and power on the heating rate and temperature distribution. The micro V-cut structure hot embossing experiment were performed to prove the potential of this moving induction heating and gas-assisted pressuring hot embossing for fast fabrication of microstructure onto polymeric substrates. As a results, replication rates were all above 95% at 200 °C and 5 kgf/cm2 and the cycle time was less than 4 min and the optic measurement shows the replicated V-cut film can enhance the 36.8% illuminance. The experiment results show the manufacturing potential of this apparatus.
| Original language | English |
|---|---|
| Pages (from-to) | 957-967 |
| Number of pages | 11 |
| Journal | Microsystem Technologies |
| Volume | 26 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2020 Mar 1 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering