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Highly uniform low-power resistive memory using nitrogen-doped tantalum pentoxide

  • C. H. Cheng*
  • , P. C. Chen
  • , Y. H. Wu
  • , M. J. Wu
  • , F. S. Yeh
  • , Albert Chin
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Highly uniform current distributions of high resistance state (HRS) and low resistance state (LRS), low 0.6 pJ switching energy, fast 30 ns switching speed, and good 10 6 cycling endurance are achieved in Ni/GeO x/Ta 2O 5-yN y/TaN resistive random access memory (RRAM) devices. Such good performance is attributed to nitrogen-related acceptor level in Ta 2O 5- yN y for better hopping conduction, which leads to forming-free resistive switching and low self-compliance switching currents.

Original languageEnglish
Pages (from-to)60-63
Number of pages4
JournalSolid-State Electronics
Volume73
DOIs
Publication statusPublished - 2012 Jul
Externally publishedYes

Keywords

  • GeO
  • Hopping conduction
  • RRAM
  • TaON
  • Uniformity

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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