TY - JOUR
T1 - High-voltage-tolerant ESD clamp circuit with low standby leakage in nanoscale CMOS process
AU - Ker, Ming Dou
AU - Lin, Chun Yu
N1 - Funding Information:
Manuscript received September 29, 2009; revised April 13, 2010; accepted April 13, 2010. Date of publication May 20, 2010; date of current version June 23, 2010. This work was supported in part by the National Science Council, Taiwan, under Contract NSC 98-2221-E-009-113-MY2, by the Ministry of Economic Affairs, Taiwan, under Grant 98-EC-17-A-01-S1-104, by the “Aim for the Top University Plan” of National Chiao-Tung University and Ministry of Education, Taiwan, and by Faraday Technology Corporation, Taiwan. The review of this paper was arranged by Editor R. Huang.
PY - 2010/7
Y1 - 2010/7
N2 - For system-on-chip applications with mixed-voltage I/O interfaces, I/O circuits with low-voltage devices must drive or receive high-voltage signals to communicate with other circuit blocks. With the consideration of low standby leakage in nanoscale CMOS processes, a new 2 × VDD -tolerant electrostatic discharge (ESD) clamp circuit by using only 1 ×V DD devices was presented in this paper. The new ESD clamp circuit had a high-voltage-tolerant ESD detection circuit to improve the turn-on efficiency of an ESD clamp device, which consisted of a silicon-controlled rectifier (SCR) with a diode in series. This design had successfully been verified in a 65-nm CMOS process. The leakage current of this ESD clamp circuit under normal circuit operating condition was only on the order of 100 nA. The test patterns with 25- and 50- \mu\hbox{m} SCR-based ESD clamp devices can achieve 2.6- and 4.8-kV human-body-model ESD robustness, respectively. Such high-voltage-tolerant ESD clamp circuits, by using only low-voltage devices with very low standby leakage current and high ESD robustness, were very suitable for mixed-voltage I/O interfaces in nanoscale CMOS processes.
AB - For system-on-chip applications with mixed-voltage I/O interfaces, I/O circuits with low-voltage devices must drive or receive high-voltage signals to communicate with other circuit blocks. With the consideration of low standby leakage in nanoscale CMOS processes, a new 2 × VDD -tolerant electrostatic discharge (ESD) clamp circuit by using only 1 ×V DD devices was presented in this paper. The new ESD clamp circuit had a high-voltage-tolerant ESD detection circuit to improve the turn-on efficiency of an ESD clamp device, which consisted of a silicon-controlled rectifier (SCR) with a diode in series. This design had successfully been verified in a 65-nm CMOS process. The leakage current of this ESD clamp circuit under normal circuit operating condition was only on the order of 100 nA. The test patterns with 25- and 50- \mu\hbox{m} SCR-based ESD clamp devices can achieve 2.6- and 4.8-kV human-body-model ESD robustness, respectively. Such high-voltage-tolerant ESD clamp circuits, by using only low-voltage devices with very low standby leakage current and high ESD robustness, were very suitable for mixed-voltage I/O interfaces in nanoscale CMOS processes.
KW - Electrostatic discharge (ESD)
KW - low-voltage CMOS
KW - mixed-voltage I/O
KW - power-rail ESD clamp circuit
KW - silicon-controlled rectifier (SCR)
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U2 - 10.1109/TED.2010.2049072
DO - 10.1109/TED.2010.2049072
M3 - Article
AN - SCOPUS:77954033255
SN - 0018-9383
VL - 57
SP - 1636
EP - 1641
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 7
M1 - 5467173
ER -