Abstract
We fabricated high performance gate-last TaN/La2O 3/SiO2 on Ge n-MOSFET. Small equivalent-oxide-thickness (EOT) of 1.9-nm and high-field mobility of 258 cm2/V s at 0.75 MV/cm were obtained, which were attributed to the thin SiO2-like barrier layer and low process temperature to prevent interfacial reaction during post-deposition annealing (PDA).
Original language | English |
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Pages (from-to) | 64-67 |
Number of pages | 4 |
Journal | Solid-State Electronics |
Volume | 55 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2011 Jan |
Externally published | Yes |
Keywords
- EOT
- Ge
- High-κ dielectric
- Mobility
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry