High etching rate of GaN films by KrF excimer laser

Chen Fu Chu*, C. K. Lee, C. C. Yu, Y. K. Wang, J. Y. Tasi, C. R. Yang, S. C. Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)


A study of laser processing of gallium nitride (GaN) material is reported. A pulsed KrF excimer laser at 248 nm with 20-nsec pulse width and 1 Hz repetition rate is used to etch the GaN film. We establish the material etching parameters under different environmental conditions. By changing the pulsed energy at constant pulse numbers, ablation of GaN surface was observed at threshold laser fluence about 0.3 J cm-2. Laser etching increase with reducing environment pressure. At 1.0 J cm-2 laser fluence, the etching rate is about 35 nm per pulse at atmosphere pressure and increases to 60 nm per pulse at low pressure. The etched depth also increases with increasing laser fluence. The surface morphology of the etched surface was also investigated.

Original languageEnglish
Pages (from-to)42-44
Number of pages3
JournalMaterials Science and Engineering B: Solid-State Materials for Advanced Technology
Issue number1-3
Publication statusPublished - 2001 May 22
Externally publishedYes


  • Atmosphere pressure
  • Environmental conditions
  • GaN
  • KrF excimer laser
  • Low pressure

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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