Ge outdiffusion effect on flicker noise in strained-Si nMOSFETs

W. C. Hua*, M. H. Lee, P. S. Chen, S. Maikap, C. W. Liu, K. M. Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

59 Citations (Scopus)


The flicker noise characteristics of strained-Si nMOSFETs are significantly dependent on the gate oxide formation. At high temperature (900 °C) thermal oxidation, the Si interstitials at the Si/oxide interface were injected into the underneath Si-SiGe heterojunction, and enhanced the Ge outdiffusion into the Si/oxide interface. The Ge atoms at Si/oxide interface act as trap centers, and the strained-Si nMOSFET with thermal gate oxide yields a much larger flicker noise than the control Si device. The Ge outdiffusion is suppressed for the device with the low temperature (700 °C) tetraethylorthosilicate gate oxide. The capacitance-voltage measurements of the strained-Si devices with thermal oxide also show that the Si/oxide interface trap density increases and the Si-SiGe heterojunction is smeared out due to the Ge outdiffusion.

Original languageEnglish
Pages (from-to)693-695
Number of pages3
JournalIEEE Electron Device Letters
Issue number10
Publication statusPublished - 2004 Oct
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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