Functional electroless gold Ohmic contacts in light emitting diodes

P. Y. Chen; H. C. Wong; S. F. Hu; C. Y. Huang; R. S. Liu

doi:10.1063/1.3624831

Functional electroless gold Ohmic contacts in light emitting diodes

P. Y. Chen, H. C. Wong, S. F. Hu^*, C. Y. Huang, R. S. Liu

^*Corresponding author for this work

Department of Physics

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.

Original language	English
Article number	063511
Journal	Applied Physics Letters
Volume	99
Issue number	6
DOIs	https://doi.org/10.1063/1.3624831
Publication status	Published - 2011 Aug 8

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.3624831

Cite this

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title = "Functional electroless gold Ohmic contacts in light emitting diodes",

abstract = "Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.",

author = "Chen, {P. Y.} and Wong, {H. C.} and Hu, {S. F.} and Huang, {C. Y.} and Liu, {R. S.}",

note = "Funding Information: The authors would like to thank Epistar Corp. and the National Science Council of the Republic of China, Taiwan (Contracts Nos. NSC 99-2112-M-003-007-MY3 and NSC 99-2113-M-002-012-MY3) for financially supporting this research. ",

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doi = "10.1063/1.3624831",

language = "English",

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TY - JOUR

T1 - Functional electroless gold Ohmic contacts in light emitting diodes

AU - Chen, P. Y.

AU - Wong, H. C.

AU - Hu, S. F.

AU - Huang, C. Y.

AU - Liu, R. S.

N1 - Funding Information: The authors would like to thank Epistar Corp. and the National Science Council of the Republic of China, Taiwan (Contracts Nos. NSC 99-2112-M-003-007-MY3 and NSC 99-2113-M-002-012-MY3) for financially supporting this research.

PY - 2011/8/8

Y1 - 2011/8/8

N2 - Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.

AB - Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.

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Functional electroless gold Ohmic contacts in light emitting diodes

Abstract

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