Functional electroless gold Ohmic contacts in light emitting diodes

P. Y. Chen, H. C. Wong, Shu-Fen Hu, C. Y. Huang, R. S. Liu

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.

Original languageEnglish
Article number063511
JournalApplied Physics Letters
Volume99
Issue number6
DOIs
Publication statusPublished - 2011 Aug 8

Fingerprint

plating
electric contacts
light emitting diodes
gold
reagents
hardness
chips
evaporation
electrolytes
wire
color
conduction
life (durability)
electrical resistivity

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Functional electroless gold Ohmic contacts in light emitting diodes. / Chen, P. Y.; Wong, H. C.; Hu, Shu-Fen; Huang, C. Y.; Liu, R. S.

In: Applied Physics Letters, Vol. 99, No. 6, 063511, 08.08.2011.

Research output: Contribution to journalArticle

Chen, P. Y. ; Wong, H. C. ; Hu, Shu-Fen ; Huang, C. Y. ; Liu, R. S. / Functional electroless gold Ohmic contacts in light emitting diodes. In: Applied Physics Letters. 2011 ; Vol. 99, No. 6.
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