Flip-chip-assembled W-band CMOS chip modules on ceramic integrated passive device with transition compensation for millimeter-wave system-in-package integration

Hsin Chia Lu*, Che Chung Kuo, Po An Lin, Chen Fang Tai, Yi Long Chang, Yu Sian Jiang, Jeng Han Tsai, Yue Ming Hsin, Huei Wang

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

46 Citations (Scopus)

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Computer Science