Fabrication of a miniature diamond grinding tool using a hybrid process of micro-EDM and co-deposition

Shun Tong Chen*, Yun Cheng Lai, Ching Chang Liu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)


A novel miniature diamond grinding tool usable for the precise micro-grinding of miniature parts is presented. A hybrid process that combines 'micro-EDM' with 'precision co-deposition' is proposed. The metal substrate is micro-EDMed to a 50 νm diameter and micro diamonds with 0-2 νm grains are 'electroformed' on the substrate surface, producing a miniature multilayered grinding tool. Nickel and diamond act as binders and cutters, respectively. A partition plate with an array of drilled holes is designed to ensure good convection in the electroforming solution. The dispersion of diamond grains and displacement of nickel ions are noticeably improved. A miniature funnel mould enables the diamond grains to converge towards the cathode to increase their deposition probability on the substrate, thereby improving their distribution on the substrate surface. A micro ZrO2 ceramic ferrule is finely ground by the developed grinding tool and then yields a surface roughness of R a = 0.085 νm. The proposed approach is applied during the final machining process.

Original languageEnglish
Article number055005
JournalJournal of Micromechanics and Microengineering
Issue number5
Publication statusPublished - 2008 May 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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