Evaluation of the flaw depth using high-Tc SQUID

H. E. Horng; J. T. Jeng; H. C. Yang; J. C. Chen

doi:10.1016/S0921-4534(01)01021-8

Evaluation of the flaw depth using high-T_c SQUID

H. E. Horng^*
, J. T. Jeng
, H. C. Yang
, J. C. Chen

^*Corresponding author for this work

Undergraduate Program of Electro-Optical Engineering

Research output: Contribution to journal › Article › peer-review

12 Citations (Scopus)

Abstract

Using high-T_c SQUID, we investigated quantitative nondestructive evaluation for flaws in conducting samples. The spatial derivative of the defect field was found to provide valuable information about the position and the depth of the flaw. By analyzing the spatial derivative of the defect field, the quantitative flaw evaluation was demonstrated.

Original language	English
Pages (from-to)	303-307
Number of pages	5
Journal	Physica C: Superconductivity and its Applications
Volume	367
Issue number	1-4
DOIs	https://doi.org/10.1016/S0921-4534(01)01021-8
Publication status	Published - 2002 Feb 15

Keywords

Defect field
Flaw depth
Nondestructive evaluation
SQUID

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Energy Engineering and Power Technology
Electrical and Electronic Engineering

Access to Document

10.1016/S0921-4534(01)01021-8

Cite this

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title = "Evaluation of the flaw depth using high-Tc SQUID",

abstract = "Using high-Tc SQUID, we investigated quantitative nondestructive evaluation for flaws in conducting samples. The spatial derivative of the defect field was found to provide valuable information about the position and the depth of the flaw. By analyzing the spatial derivative of the defect field, the quantitative flaw evaluation was demonstrated.",

keywords = "Defect field, Flaw depth, Nondestructive evaluation, SQUID",

author = "Horng, \{H. E.\} and Jeng, \{J. T.\} and Yang, \{H. C.\} and Chen, \{J. C.\}",

note = "Funding Information: This work is supported by the National Science Council of ROC under grant no. NSC89-2112-M-003-040, and NSC89-2112-M-002-071.",

year = "2002",

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day = "15",

doi = "10.1016/S0921-4534(01)01021-8",

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T1 - Evaluation of the flaw depth using high-Tc SQUID

AU - Horng, H. E.

AU - Jeng, J. T.

AU - Yang, H. C.

AU - Chen, J. C.

N1 - Funding Information: This work is supported by the National Science Council of ROC under grant no. NSC89-2112-M-003-040, and NSC89-2112-M-002-071.

PY - 2002/2/15

Y1 - 2002/2/15

N2 - Using high-Tc SQUID, we investigated quantitative nondestructive evaluation for flaws in conducting samples. The spatial derivative of the defect field was found to provide valuable information about the position and the depth of the flaw. By analyzing the spatial derivative of the defect field, the quantitative flaw evaluation was demonstrated.

AB - Using high-Tc SQUID, we investigated quantitative nondestructive evaluation for flaws in conducting samples. The spatial derivative of the defect field was found to provide valuable information about the position and the depth of the flaw. By analyzing the spatial derivative of the defect field, the quantitative flaw evaluation was demonstrated.

KW - Defect field

KW - Flaw depth

KW - Nondestructive evaluation

KW - SQUID

UR - https://www.scopus.com/pages/publications/0037082812

UR - https://www.scopus.com/pages/publications/0037082812#tab=citedBy

U2 - 10.1016/S0921-4534(01)01021-8

DO - 10.1016/S0921-4534(01)01021-8

M3 - Article

AN - SCOPUS:0037082812

SN - 0921-4534

VL - 367

SP - 303

EP - 307

JO - Physica C: Superconductivity and its Applications

JF - Physica C: Superconductivity and its Applications

IS - 1-4

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