Evaluation of the flaw depth using high-Tc SQUID

H. E. Horng, J. T. Jeng, H. C. Yang, J. C. Chen

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Using high-Tc SQUID, we investigated quantitative nondestructive evaluation for flaws in conducting samples. The spatial derivative of the defect field was found to provide valuable information about the position and the depth of the flaw. By analyzing the spatial derivative of the defect field, the quantitative flaw evaluation was demonstrated.

Original languageEnglish
Pages (from-to)303-307
Number of pages5
JournalPhysica C: Superconductivity and its applications
Volume367
Issue number1-4
DOIs
Publication statusPublished - 2002 Feb 15

Keywords

  • Defect field
  • Flaw depth
  • Nondestructive evaluation
  • SQUID

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Evaluation of the flaw depth using high-T<sub>c</sub> SQUID'. Together they form a unique fingerprint.

  • Cite this