ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications

Ming Dou Ker, Chun Yu Lin, Yi Han Wu, Wen Tai Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

On-chip electrostatic discharge (ESD) protection design with low-leakage consideration for the silicon chips of IoT applications is presented. The proposed ESD protection design uses the fast turn-on silicon-controlled rectifier (SCR) device to implement the power-rail ESD clamp circuit. Experimental results verified in TSMC 28nm CMOS process have shown that the proposed design has advantages of low leakage current (2∼3nA), low trigger voltage (∼2V), high ESD robustness (>8kV), and free to latchup issue.

Original languageEnglish
Title of host publication2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1496-1499
Number of pages4
ISBN (Print)9781538604892
DOIs
Publication statusPublished - 2018 Aug 24
Event7th IEEE Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017 - Honolulu, United States
Duration: 2017 Jul 312017 Aug 4

Publication series

Name2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017

Conference

Conference7th IEEE Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017
CountryUnited States
CityHonolulu
Period17/7/3117/8/4

Fingerprint

Electrostatic discharge
Leakage
Electrostatics
Silicon
Chip
Leakage Current
Clamping devices
Thyristors
Trigger
Leakage currents
Rails
Voltage
Robustness
Design
Internet of things
Networks (circuits)
Experimental Results
Electric potential

Keywords

  • CMOS
  • electrostatic discharge (ESD)
  • ESD protection
  • low-leakage

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Science Applications
  • Control and Optimization

Cite this

Ker, M. D., Lin, C. Y., Wu, Y. H., & Wang, W. T. (2018). ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications. In 2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017 (pp. 1496-1499). [8446566] (2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CYBER.2017.8446566

ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications. / Ker, Ming Dou; Lin, Chun Yu; Wu, Yi Han; Wang, Wen Tai.

2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1496-1499 8446566 (2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ker, MD, Lin, CY, Wu, YH & Wang, WT 2018, ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications. in 2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017., 8446566, 2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017, Institute of Electrical and Electronics Engineers Inc., pp. 1496-1499, 7th IEEE Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017, Honolulu, United States, 17/7/31. https://doi.org/10.1109/CYBER.2017.8446566
Ker MD, Lin CY, Wu YH, Wang WT. ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications. In 2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1496-1499. 8446566. (2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017). https://doi.org/10.1109/CYBER.2017.8446566
Ker, Ming Dou ; Lin, Chun Yu ; Wu, Yi Han ; Wang, Wen Tai. / ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications. 2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1496-1499 (2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017).
@inproceedings{79cc7f8ecc234b938300ca846e4878b9,
title = "ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications",
abstract = "On-chip electrostatic discharge (ESD) protection design with low-leakage consideration for the silicon chips of IoT applications is presented. The proposed ESD protection design uses the fast turn-on silicon-controlled rectifier (SCR) device to implement the power-rail ESD clamp circuit. Experimental results verified in TSMC 28nm CMOS process have shown that the proposed design has advantages of low leakage current (2∼3nA), low trigger voltage (∼2V), high ESD robustness (>8kV), and free to latchup issue.",
keywords = "CMOS, electrostatic discharge (ESD), ESD protection, low-leakage",
author = "Ker, {Ming Dou} and Lin, {Chun Yu} and Wu, {Yi Han} and Wang, {Wen Tai}",
year = "2018",
month = "8",
day = "24",
doi = "10.1109/CYBER.2017.8446566",
language = "English",
isbn = "9781538604892",
series = "2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1496--1499",
booktitle = "2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017",

}

TY - GEN

T1 - ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications

AU - Ker, Ming Dou

AU - Lin, Chun Yu

AU - Wu, Yi Han

AU - Wang, Wen Tai

PY - 2018/8/24

Y1 - 2018/8/24

N2 - On-chip electrostatic discharge (ESD) protection design with low-leakage consideration for the silicon chips of IoT applications is presented. The proposed ESD protection design uses the fast turn-on silicon-controlled rectifier (SCR) device to implement the power-rail ESD clamp circuit. Experimental results verified in TSMC 28nm CMOS process have shown that the proposed design has advantages of low leakage current (2∼3nA), low trigger voltage (∼2V), high ESD robustness (>8kV), and free to latchup issue.

AB - On-chip electrostatic discharge (ESD) protection design with low-leakage consideration for the silicon chips of IoT applications is presented. The proposed ESD protection design uses the fast turn-on silicon-controlled rectifier (SCR) device to implement the power-rail ESD clamp circuit. Experimental results verified in TSMC 28nm CMOS process have shown that the proposed design has advantages of low leakage current (2∼3nA), low trigger voltage (∼2V), high ESD robustness (>8kV), and free to latchup issue.

KW - CMOS

KW - electrostatic discharge (ESD)

KW - ESD protection

KW - low-leakage

UR - http://www.scopus.com/inward/record.url?scp=85053845896&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85053845896&partnerID=8YFLogxK

U2 - 10.1109/CYBER.2017.8446566

DO - 10.1109/CYBER.2017.8446566

M3 - Conference contribution

AN - SCOPUS:85053845896

SN - 9781538604892

T3 - 2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017

SP - 1496

EP - 1499

BT - 2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017

PB - Institute of Electrical and Electronics Engineers Inc.

ER -