Endurance > 1011Cycling of 3D GAA Nanosheet Ferroelectric FET with Stacked HfZrO2to Homogenize Corner Field Toward Mitigate Dead Zone for High-Density eNVM

C. Y. Liao, K. Y. Hsiang, Z. F. Lou, H. C. Tseng, C. Y. Lin, Z. X. Li, F. C. Hsieh, C. C. Wang, F. S. Chang, W. C. Ray, Y. Y. Tseng, S. T. Chang, T. C. Chen, M. H. Lee*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

After 1011 high endurance cycles with memory window (MW) =0.9 V is achieved for the 3D gate-all-around (GAA) nanosheet (NS) ferroelectric field-effect transistor (FeFET) based on double-HZO; the aim is to homogenize the corner field and mitigate dead zones. The interlayer Al2O3 or TiN in the double-HZO exhibits MW enhancement or low access voltage, respectively. The proposed MFMFS GAA-FeFET demonstrates a low VP/E = ±3.5 V (±2.3 MV/cm), large MW = 1.3 V, >1011 robust endurance cycles, and stable storage with data retention of >2×104 s; therefore, physical dimension scaling of the embedded nonvolatile memory (eNVM) is feasible for future generations.

Original languageEnglish
Title of host publication2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages393-394
Number of pages2
ISBN (Electronic)9781665497725
DOIs
Publication statusPublished - 2022
Event2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 - Honolulu, United States
Duration: 2022 Jun 122022 Jun 17

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
Volume2022-June
ISSN (Print)0743-1562

Conference

Conference2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
Country/TerritoryUnited States
CityHonolulu
Period2022/06/122022/06/17

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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