Embedded PUF on 14nm HKMG FinFET Platform: A Novel 2-bit-per-cell OTP-based Memory Feasible for IoT Secuirty Solution in 5G Era

E. R. Hsieh, H. W. Wang, C. H. Liu, Steve S. Chung, T. P. Chen, S. A. Huang, T. J. Chen, Osbert Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, a novel concept of 2-bit-per-cell (2B/C) is introduced to realize high-density OTP PUF from a new scheme of dielectric breakdown. This PUF shows 105x of large window, good immunity to high-temperature disturbance, and excellent retention under 150°C baking, which are particularly for automotive applications. In terms of security, this PUF exhibits near ideal normal distribution of hamming distance and narrow distribution of hamming weight. The bit error rates are low, 0.78% at 25°C and 1.95% at 150°C, benchmarked on a 256-bit array. Finally, the security test of this PUF against the hackers' attack from the machine learning process has been proved to have high security. Overall, the proposed 2B/C OTP PUF demonstrated great potential for IoT security in 5G era.

Original languageEnglish
Title of host publication2019 Symposium on VLSI Technology, VLSI Technology 2019 - Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
PagesT118-T119
ISBN (Electronic)9784863487178
DOIs
Publication statusPublished - 2019 Jun
Event39th Symposium on VLSI Technology, VLSI Technology 2019 - Kyoto, Japan
Duration: 2019 Jun 92019 Jun 14

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
Volume2019-June
ISSN (Print)0743-1562

Conference

Conference39th Symposium on VLSI Technology, VLSI Technology 2019
CountryJapan
CityKyoto
Period19/6/919/6/14

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Hsieh, E. R., Wang, H. W., Liu, C. H., Chung, S. S., Chen, T. P., Huang, S. A., Chen, T. J., & Cheng, O. (2019). Embedded PUF on 14nm HKMG FinFET Platform: A Novel 2-bit-per-cell OTP-based Memory Feasible for IoT Secuirty Solution in 5G Era. In 2019 Symposium on VLSI Technology, VLSI Technology 2019 - Digest of Technical Papers (pp. T118-T119). [8776515] (Digest of Technical Papers - Symposium on VLSI Technology; Vol. 2019-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/VLSIT.2019.8776515