Efficiency of dispenser with nozzle technology in assembly

Mu Chun Wang; Kuo Shu Huang; Shuang Yuan Chen; Zhen Ying Hsieh; Hsin Chia Yang; Chuan Hsi Liu; Chii Ruey Lin

doi:10.1109/ICEPT.2010.5583781

Efficiency of dispenser with nozzle technology in assembly

Mu Chun Wang^*, Kuo Shu Huang, Shuang Yuan Chen, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

^*Corresponding author for this work

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.

Original language	English
Title of host publication	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages	476-479
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2010.5583781
Publication status	Published - 2010
Event	2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China Duration: 2010 Aug 16 → 2010 Aug 19

Publication series

Name	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other	2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Country/Territory	China
City	Xi'an
Period	2010/08/16 → 2010/08/19

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICEPT.2010.5583781

Cite this

Wang, M. C., Huang, K. S., Chen, S. Y., Hsieh, Z. Y., Yang, H. C., Liu, C. H., & Lin, C. R. (2010). Efficiency of dispenser with nozzle technology in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (pp. 476-479). Article 5583781 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5583781

Efficiency of dispenser with nozzle technology in assembly. / Wang, Mu Chun; Huang, Kuo Shu; Chen, Shuang Yuan et al.
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 476-479 5583781 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wang, MC, Huang, KS, Chen, SY, Hsieh, ZY, Yang, HC, Liu, CH & Lin, CR 2010, Efficiency of dispenser with nozzle technology in assembly. in Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010., 5583781, Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, pp. 476-479, 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, 2010/08/16. https://doi.org/10.1109/ICEPT.2010.5583781

Wang MC, Huang KS, Chen SY, Hsieh ZY, Yang HC, Liu CH et al. Efficiency of dispenser with nozzle technology in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 476-479. 5583781. (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). doi: 10.1109/ICEPT.2010.5583781

Wang, Mu Chun ; Huang, Kuo Shu ; Chen, Shuang Yuan et al. / Efficiency of dispenser with nozzle technology in assembly. Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. pp. 476-479 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).

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abstract = "The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.",

author = "Wang, {Mu Chun} and Huang, {Kuo Shu} and Chen, {Shuang Yuan} and Hsieh, {Zhen Ying} and Yang, {Hsin Chia} and Liu, {Chuan Hsi} and Lin, {Chii Ruey}",

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Efficiency of dispenser with nozzle technology in assembly

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