Efficiency of dispenser with nozzle technology in assembly

Mu Chun Wang, Kuo Shu Huang, Shuang Yuan Chen, Zhen Ying Hsieh, Hsin Chia Yang, Chuan-Hsi Liu, Chii Ruey Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.

Original languageEnglish
Title of host publicationProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages476-479
Number of pages4
DOIs
Publication statusPublished - 2010 Nov 24
Event2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China
Duration: 2010 Aug 162010 Aug 19

Publication series

NameProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
CountryChina
CityXi'an
Period10/8/1610/8/19

Fingerprint

Dispensers
Nozzles
Packaging
Throughput

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Wang, M. C., Huang, K. S., Chen, S. Y., Hsieh, Z. Y., Yang, H. C., Liu, C-H., & Lin, C. R. (2010). Efficiency of dispenser with nozzle technology in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (pp. 476-479). [5583781] (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5583781

Efficiency of dispenser with nozzle technology in assembly. / Wang, Mu Chun; Huang, Kuo Shu; Chen, Shuang Yuan; Hsieh, Zhen Ying; Yang, Hsin Chia; Liu, Chuan-Hsi; Lin, Chii Ruey.

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 476-479 5583781 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wang, MC, Huang, KS, Chen, SY, Hsieh, ZY, Yang, HC, Liu, C-H & Lin, CR 2010, Efficiency of dispenser with nozzle technology in assembly. in Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010., 5583781, Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, pp. 476-479, 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, 10/8/16. https://doi.org/10.1109/ICEPT.2010.5583781
Wang MC, Huang KS, Chen SY, Hsieh ZY, Yang HC, Liu C-H et al. Efficiency of dispenser with nozzle technology in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 476-479. 5583781. (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5583781
Wang, Mu Chun ; Huang, Kuo Shu ; Chen, Shuang Yuan ; Hsieh, Zhen Ying ; Yang, Hsin Chia ; Liu, Chuan-Hsi ; Lin, Chii Ruey. / Efficiency of dispenser with nozzle technology in assembly. Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. pp. 476-479 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).
@inproceedings{8e3f9c5b090148ac87f2aa9d35bb7aea,
title = "Efficiency of dispenser with nozzle technology in assembly",
abstract = "The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.",
author = "Wang, {Mu Chun} and Huang, {Kuo Shu} and Chen, {Shuang Yuan} and Hsieh, {Zhen Ying} and Yang, {Hsin Chia} and Chuan-Hsi Liu and Lin, {Chii Ruey}",
year = "2010",
month = "11",
day = "24",
doi = "10.1109/ICEPT.2010.5583781",
language = "English",
isbn = "9781424481422",
series = "Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010",
pages = "476--479",
booktitle = "Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010",

}

TY - GEN

T1 - Efficiency of dispenser with nozzle technology in assembly

AU - Wang, Mu Chun

AU - Huang, Kuo Shu

AU - Chen, Shuang Yuan

AU - Hsieh, Zhen Ying

AU - Yang, Hsin Chia

AU - Liu, Chuan-Hsi

AU - Lin, Chii Ruey

PY - 2010/11/24

Y1 - 2010/11/24

N2 - The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.

AB - The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.

UR - http://www.scopus.com/inward/record.url?scp=78449290938&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78449290938&partnerID=8YFLogxK

U2 - 10.1109/ICEPT.2010.5583781

DO - 10.1109/ICEPT.2010.5583781

M3 - Conference contribution

AN - SCOPUS:78449290938

SN - 9781424481422

T3 - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

SP - 476

EP - 479

BT - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

ER -