Efficiency of dispenser with nozzle technology in assembly

Mu Chun Wang, Kuo Shu Huang, Shuang Yuan Chen, Zhen Ying Hsieh, Hsin Chia Yang, Chuan-Hsi Liu, Chii Ruey Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.

Original languageEnglish
Title of host publicationProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages476-479
Number of pages4
DOIs
Publication statusPublished - 2010 Nov 24
Event2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China
Duration: 2010 Aug 162010 Aug 19

Publication series

NameProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
CountryChina
CityXi'an
Period10/8/1610/8/19

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Wang, M. C., Huang, K. S., Chen, S. Y., Hsieh, Z. Y., Yang, H. C., Liu, C-H., & Lin, C. R. (2010). Efficiency of dispenser with nozzle technology in assembly. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (pp. 476-479). [5583781] (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5583781