Effect of the grooved SrTiO3 bicrystal line on the YBa2Cu3O7 grain boundary

Hsiao Wen Yu, Ming Jye Chen, Hong-Chang Yang, Shieh-Yueh Yang, Herng-Er Horng

    Research output: Contribution to journalArticle

    5 Citations (Scopus)

    Abstract

    Using atomic force microscope (AFM), we have investigated the correlation between the characteristics of grooved SrTiO3 (STO) bicrystal line and the grain-boundary (GB) microstructure of the YBa2Cu3Oy (YBCO) film. When the underlying groove becomes deeper and steeper, the density of growth spirals along the boundary line increases and the meandering configuration of GB gradually disappears. From the measured signals of the dc-SQUIDs patterned on the films, we also conclude that the homogeneity of the GB is improved.

    Original languageEnglish
    Pages (from-to)163-169
    Number of pages7
    JournalPhysica C: Superconductivity and its applications
    Volume333
    Issue number3
    DOIs
    Publication statusPublished - 2000 May 20

    Fingerprint

    Bicrystals
    bicrystals
    Grain boundaries
    grain boundaries
    SQUIDs
    grooves
    homogeneity
    Microscopes
    microscopes
    microstructure
    Microstructure
    configurations
    barium copper yttrium oxide
    strontium titanium oxide

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Energy Engineering and Power Technology
    • Electrical and Electronic Engineering

    Cite this

    Effect of the grooved SrTiO3 bicrystal line on the YBa2Cu3O7 grain boundary. / Yu, Hsiao Wen; Chen, Ming Jye; Yang, Hong-Chang; Yang, Shieh-Yueh; Horng, Herng-Er.

    In: Physica C: Superconductivity and its applications, Vol. 333, No. 3, 20.05.2000, p. 163-169.

    Research output: Contribution to journalArticle

    Yu, Hsiao Wen ; Chen, Ming Jye ; Yang, Hong-Chang ; Yang, Shieh-Yueh ; Horng, Herng-Er. / Effect of the grooved SrTiO3 bicrystal line on the YBa2Cu3O7 grain boundary. In: Physica C: Superconductivity and its applications. 2000 ; Vol. 333, No. 3. pp. 163-169.
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