Editorial: IEDMS 2016

Chuan Hsi Liu; Chun Hu Cheng; Chin Pao Cheng; Juin J. Liou

doi:10.1016/j.microrel.2017.12.037

Editorial: IEDMS 2016

Chuan Hsi Liu^*, Chun Hu Cheng, Chin Pao Cheng, Juin J. Liou

^*Corresponding author for this work

Department of Mechatronic Engineering

Research output: Contribution to journal › Editorial › peer-review

Original language	English
Pages (from-to)	207
Number of pages	1
Journal	Microelectronics Reliability
Volume	83
DOIs	https://doi.org/10.1016/j.microrel.2017.12.037
Publication status	Published - 2018 Apr

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Safety, Risk, Reliability and Quality
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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10.1016/j.microrel.2017.12.037

Cite this

@article{cba243a642d242d89d1029afbf731ce6,

title = "Editorial: IEDMS 2016",

author = "Liu, {Chuan Hsi} and Cheng, {Chun Hu} and Cheng, {Chin Pao} and Liou, {Juin J.}",

year = "2018",

month = apr,

doi = "10.1016/j.microrel.2017.12.037",

language = "English",

volume = "83",

pages = "207",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Limited",

}

TY - JOUR

T1 - Editorial

T2 - IEDMS 2016

AU - Liu, Chuan Hsi

AU - Cheng, Chun Hu

AU - Cheng, Chin Pao

AU - Liou, Juin J.

PY - 2018/4

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U2 - 10.1016/j.microrel.2017.12.037

DO - 10.1016/j.microrel.2017.12.037

M3 - Editorial

AN - SCOPUS:85040109838

SN - 0026-2714

VL - 83

SP - 207

JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -

Editorial: IEDMS 2016

ASJC Scopus subject areas

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