@inproceedings{c1a86d274d0d4b938d6013e99937b473,
title = "Development of composite vertical wet etching for silicon material",
abstract = "In this research, we combined the electrochemical etching (ECE) and the metal-assisted chemical etching (MACE) to develop a composite vertical etching process for silicon material and then discuss the etching results influenced by experimental parameters. The experimental results show that the developed composite etching process has faster etching rate than both electrochemical etching and metal-assisted chemical etching process. When a bias of 0.25 V is applied and the catalytic material is 10 nm in thickness, a 30 μm-depth vertical structure can be generated which is 3 times than the structure yield by metal-assisted chemical etching.",
keywords = "Bulk silicon micromachining, Electrochemical etching, Metal assisted chemical etching",
author = "Huang, {Mao Jung} and Chang, {Chun Ming} and Chu, {Nien Nan} and Tang, {Yu Hsiang} and Yang, {Chii Rong}",
year = "2014",
month = sep,
day = "23",
doi = "10.1109/NEMS.2014.6908875",
language = "English",
series = "9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "564--567",
booktitle = "9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014",
note = "9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 ; Conference date: 13-04-2014 Through 16-04-2014",
}