Development of composite vertical wet etching for silicon material

Mao Jung Huang, Chun Ming Chang, Nien Nan Chu, Yu Hsiang Tang, Chii Rong Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this research, we combined the electrochemical etching (ECE) and the metal-assisted chemical etching (MACE) to develop a composite vertical etching process for silicon material and then discuss the etching results influenced by experimental parameters. The experimental results show that the developed composite etching process has faster etching rate than both electrochemical etching and metal-assisted chemical etching process. When a bias of 0.25 V is applied and the catalytic material is 10 nm in thickness, a 30 μm-depth vertical structure can be generated which is 3 times than the structure yield by metal-assisted chemical etching.

Original languageEnglish
Title of host publication9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages564-567
Number of pages4
ISBN (Electronic)9781479947270
DOIs
Publication statusPublished - 2014 Jan 1
Event9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 - Waikiki Beach, United States
Duration: 2014 Apr 132014 Apr 16

Other

Other9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
CountryUnited States
CityWaikiki Beach
Period14/4/1314/4/16

Fingerprint

Wet etching
Etching
Silicon
Composite materials
Electrochemical etching
Metals

Keywords

  • Bulk silicon micromachining
  • Electrochemical etching
  • Metal assisted chemical etching

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Huang, M. J., Chang, C. M., Chu, N. N., Tang, Y. H., & Yang, C. R. (2014). Development of composite vertical wet etching for silicon material. In 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 (pp. 564-567). [6908875] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2014.6908875

Development of composite vertical wet etching for silicon material. / Huang, Mao Jung; Chang, Chun Ming; Chu, Nien Nan; Tang, Yu Hsiang; Yang, Chii Rong.

9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 564-567 6908875.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Huang, MJ, Chang, CM, Chu, NN, Tang, YH & Yang, CR 2014, Development of composite vertical wet etching for silicon material. in 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014., 6908875, Institute of Electrical and Electronics Engineers Inc., pp. 564-567, 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014, Waikiki Beach, United States, 14/4/13. https://doi.org/10.1109/NEMS.2014.6908875
Huang MJ, Chang CM, Chu NN, Tang YH, Yang CR. Development of composite vertical wet etching for silicon material. In 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 564-567. 6908875 https://doi.org/10.1109/NEMS.2014.6908875
Huang, Mao Jung ; Chang, Chun Ming ; Chu, Nien Nan ; Tang, Yu Hsiang ; Yang, Chii Rong. / Development of composite vertical wet etching for silicon material. 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 564-567
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