Development of an original electromagnetic damping-controlled horizontal cutting mechanism for microwire-EDM

Shun Tong Chen*, Li Wen Huang, Jin Pin Kuo, Tin Cheng Pai

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


In this study, an original ‘electromagnetic damping-controlled horizontal cutting mechanism’ is designed and proposed for precisely controlling micro-scale wire-tension for cutting a microstructure array. The electromagnetic damper uses a set of three annular electromagnets equally distributed with their end-faces orientated toward a mild-steel disc. This arrangement is located at the front of the cutting mechanism. The cutting mechanism also consists of a set of microgroove rollers, a wire-electrode guide, and an auxiliary guide designed to suppress wire-wriggling and wire-swaying in order to deliver a tungsten wire of Ø13 μm diameter at a steady state over the long-term. Experimental verification is conducted on B-NPD (boron-doped nano-polycrystalline diamond), which possesses a high melting-point and high electrical resistivity characteristics, to establish the feasibility of cutting such difficult-to-machine materials. A 'one-cut one-skim' machining approach is used whereby the surface flatness and the dimensional accuracy of the slot-wall can be improved. Experimental results found that the wire feed-rate during the finish-cutting stage can be used at a rate greater than that of the rough-cutting stage. The resultant diamond microstructure array is of high-consistency and aspect-ratio at 1:22, demonstrating that the electromagnetic damping-controlled horizontal cutting mechanism can precisely and stably control the tension and running speed of the microwire.

Original languageEnglish
Article number116538
JournalJournal of Materials Processing Technology
Publication statusPublished - 2020 Apr


  • B-NPD microstructure array
  • Electromagnetic damper
  • Horizontal cutting mechanism
  • Microwire tension
  • One-cut one-skim

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering


Dive into the research topics of 'Development of an original electromagnetic damping-controlled horizontal cutting mechanism for microwire-EDM'. Together they form a unique fingerprint.

Cite this