Development of a thin CBN grinding-tool by compound process

Shun-Tong Chen, Yun Cheng Lai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This study presents a compound process combining composite electroforming with wire Electrical Discharge Machining (w-EDM) for developing a thin cubic boron nitride (CBN) grinding-tool. A precisely designed set-up in which a small compound depositing tank providing effectual convection of a compound electroplating solution to help fabricate a CBN grinding-blank is presented. A funneled entrance design for converging CBN grits in the working tank and creating a depositing effect on the substrate is employed and proposed. Considerable micro CBN abrasives are evenly embedded into the nickel-based coating layer, which offers enough abrasives for grinding-edge. Subsequently, the coated grinding-blank is trued and dressed by using w-EDM to form a multiple thin CBN grinding-tool. Experimental results indicate that the electroforming process can create a Ni-based CBN layer of high-integrity under current density of 2 ASD and concentration of 8.6 g/l CBN grits. Moreover, the CBN grinding-edge of 10 μm in thickness (each edge) can be achieved.

Original languageEnglish
Title of host publicationInformation Technology for Manufacturing Systems IV
Pages359-363
Number of pages5
DOIs
Publication statusPublished - 2013 Oct 29
Event4th International Conference on Information Technology for Manufacturing Systems, ITMS 2013 - Auckland, New Zealand
Duration: 2013 Aug 282013 Aug 29

Publication series

NameApplied Mechanics and Materials
Volume421
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Other

Other4th International Conference on Information Technology for Manufacturing Systems, ITMS 2013
CountryNew Zealand
CityAuckland
Period13/8/2813/8/29

Keywords

  • CBN grinding-tool
  • Compound process

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Chen, S-T., & Lai, Y. C. (2013). Development of a thin CBN grinding-tool by compound process. In Information Technology for Manufacturing Systems IV (pp. 359-363). (Applied Mechanics and Materials; Vol. 421). https://doi.org/10.4028/www.scientific.net/AMM.421.359