Determination of coefficient of thermal expansion in high power GaN-based light-emitting diodes via optical coherent tomography

Ya Ju Lee, Yung Chi Yao, Yi Kai Haung, Meng Tsan Tsai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

One of the most challenging issues when operating a high-power light-emitting diode (LED) is to conduct appropriate packaging materials for the reliable thermal management of the entire device. Generally, the considerable amount of heat produced around the junction area of the LED would transfers to the entire device, and causes thermal expansion in the packaging material. It induces strain inevitably, and hinders the output performances and possible applications of high-power LEDs. The coefficient of thermal expansion (CTE) is a physical quantity that indicates the expansion to which value a material will be upon heating. Therefore, as far as an advancement of thermal management is concerned, the quantitative and real-time determination of CTE of packaging materials becomes more important than ever since the demanding of high-power LEDs is increased in recent years. In this study, we measure the CTE of GaN-based (λ = 450 nm) high-power LED encapsulated with polystyrene resin by using optical coherent tomography (OCT). The displacement change between individual junctions of OCT image is directly observed and recorded to derive the CTE values of composed components of the LED device. The obtained instant CTE of polystyrene resin is estimated to be around 10 × 10−5/°C, which is a spatial average value over the OCT scanning area of 10 μm × 10 μm. The OCT provides an alternative way to determine a real-time, non-destructive, and spatially resolved CTE values of the LED device, and that shows essential advantage over the typical CTE measurement techniques.

Original languageEnglish
Title of host publicationAdvances in Intelligent Information Hiding and Multimedia Signal Processing - Proceedings of the 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing,
EditorsJeng-Shyang Pan, Pei-Wei Tsai, Lakhmi C. Jain, Junzo Watada
PublisherSpringer Science and Business Media Deutschland GmbH
Pages147-152
Number of pages6
ISBN (Print)9783319638553
DOIs
Publication statusPublished - 2018 Jan 1
Event13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing, IIH-MSP 2017 - Matsue, Shimane, Japan
Duration: 2017 Aug 122017 Aug 15

Publication series

NameSmart Innovation, Systems and Technologies
Volume81
ISSN (Print)2190-3018
ISSN (Electronic)2190-3026

Other

Other13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing, IIH-MSP 2017
CountryJapan
CityMatsue, Shimane
Period17/8/1217/8/15

Fingerprint

Thermal expansion
Tomography
Light emitting diodes
Packaging materials
Temperature control
Polystyrenes
Resins
Coefficients
Scanning
Heating

Keywords

  • Light-emitting diodes
  • Optical coherence tomography
  • Packaging materials

ASJC Scopus subject areas

  • Decision Sciences(all)
  • Computer Science(all)

Cite this

Lee, Y. J., Yao, Y. C., Haung, Y. K., & Tsai, M. T. (2018). Determination of coefficient of thermal expansion in high power GaN-based light-emitting diodes via optical coherent tomography. In J-S. Pan, P-W. Tsai, L. C. Jain, & J. Watada (Eds.), Advances in Intelligent Information Hiding and Multimedia Signal Processing - Proceedings of the 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing, (pp. 147-152). (Smart Innovation, Systems and Technologies; Vol. 81). Springer Science and Business Media Deutschland GmbH. https://doi.org/10.1007/978-3-319-63856-0_18

Determination of coefficient of thermal expansion in high power GaN-based light-emitting diodes via optical coherent tomography. / Lee, Ya Ju; Yao, Yung Chi; Haung, Yi Kai; Tsai, Meng Tsan.

Advances in Intelligent Information Hiding and Multimedia Signal Processing - Proceedings of the 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing,. ed. / Jeng-Shyang Pan; Pei-Wei Tsai; Lakhmi C. Jain; Junzo Watada. Springer Science and Business Media Deutschland GmbH, 2018. p. 147-152 (Smart Innovation, Systems and Technologies; Vol. 81).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lee, YJ, Yao, YC, Haung, YK & Tsai, MT 2018, Determination of coefficient of thermal expansion in high power GaN-based light-emitting diodes via optical coherent tomography. in J-S Pan, P-W Tsai, LC Jain & J Watada (eds), Advances in Intelligent Information Hiding and Multimedia Signal Processing - Proceedings of the 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing,. Smart Innovation, Systems and Technologies, vol. 81, Springer Science and Business Media Deutschland GmbH, pp. 147-152, 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing, IIH-MSP 2017, Matsue, Shimane, Japan, 17/8/12. https://doi.org/10.1007/978-3-319-63856-0_18
Lee YJ, Yao YC, Haung YK, Tsai MT. Determination of coefficient of thermal expansion in high power GaN-based light-emitting diodes via optical coherent tomography. In Pan J-S, Tsai P-W, Jain LC, Watada J, editors, Advances in Intelligent Information Hiding and Multimedia Signal Processing - Proceedings of the 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing,. Springer Science and Business Media Deutschland GmbH. 2018. p. 147-152. (Smart Innovation, Systems and Technologies). https://doi.org/10.1007/978-3-319-63856-0_18
Lee, Ya Ju ; Yao, Yung Chi ; Haung, Yi Kai ; Tsai, Meng Tsan. / Determination of coefficient of thermal expansion in high power GaN-based light-emitting diodes via optical coherent tomography. Advances in Intelligent Information Hiding and Multimedia Signal Processing - Proceedings of the 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing,. editor / Jeng-Shyang Pan ; Pei-Wei Tsai ; Lakhmi C. Jain ; Junzo Watada. Springer Science and Business Media Deutschland GmbH, 2018. pp. 147-152 (Smart Innovation, Systems and Technologies).
@inproceedings{7775b7f1d1b74a16b5c476ae6079b339,
title = "Determination of coefficient of thermal expansion in high power GaN-based light-emitting diodes via optical coherent tomography",
abstract = "One of the most challenging issues when operating a high-power light-emitting diode (LED) is to conduct appropriate packaging materials for the reliable thermal management of the entire device. Generally, the considerable amount of heat produced around the junction area of the LED would transfers to the entire device, and causes thermal expansion in the packaging material. It induces strain inevitably, and hinders the output performances and possible applications of high-power LEDs. The coefficient of thermal expansion (CTE) is a physical quantity that indicates the expansion to which value a material will be upon heating. Therefore, as far as an advancement of thermal management is concerned, the quantitative and real-time determination of CTE of packaging materials becomes more important than ever since the demanding of high-power LEDs is increased in recent years. In this study, we measure the CTE of GaN-based (λ = 450 nm) high-power LED encapsulated with polystyrene resin by using optical coherent tomography (OCT). The displacement change between individual junctions of OCT image is directly observed and recorded to derive the CTE values of composed components of the LED device. The obtained instant CTE of polystyrene resin is estimated to be around 10 × 10−5/°C, which is a spatial average value over the OCT scanning area of 10 μm × 10 μm. The OCT provides an alternative way to determine a real-time, non-destructive, and spatially resolved CTE values of the LED device, and that shows essential advantage over the typical CTE measurement techniques.",
keywords = "Light-emitting diodes, Optical coherence tomography, Packaging materials",
author = "Lee, {Ya Ju} and Yao, {Yung Chi} and Haung, {Yi Kai} and Tsai, {Meng Tsan}",
year = "2018",
month = "1",
day = "1",
doi = "10.1007/978-3-319-63856-0_18",
language = "English",
isbn = "9783319638553",
series = "Smart Innovation, Systems and Technologies",
publisher = "Springer Science and Business Media Deutschland GmbH",
pages = "147--152",
editor = "Jeng-Shyang Pan and Pei-Wei Tsai and Jain, {Lakhmi C.} and Junzo Watada",
booktitle = "Advances in Intelligent Information Hiding and Multimedia Signal Processing - Proceedings of the 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing,",

}

TY - GEN

T1 - Determination of coefficient of thermal expansion in high power GaN-based light-emitting diodes via optical coherent tomography

AU - Lee, Ya Ju

AU - Yao, Yung Chi

AU - Haung, Yi Kai

AU - Tsai, Meng Tsan

PY - 2018/1/1

Y1 - 2018/1/1

N2 - One of the most challenging issues when operating a high-power light-emitting diode (LED) is to conduct appropriate packaging materials for the reliable thermal management of the entire device. Generally, the considerable amount of heat produced around the junction area of the LED would transfers to the entire device, and causes thermal expansion in the packaging material. It induces strain inevitably, and hinders the output performances and possible applications of high-power LEDs. The coefficient of thermal expansion (CTE) is a physical quantity that indicates the expansion to which value a material will be upon heating. Therefore, as far as an advancement of thermal management is concerned, the quantitative and real-time determination of CTE of packaging materials becomes more important than ever since the demanding of high-power LEDs is increased in recent years. In this study, we measure the CTE of GaN-based (λ = 450 nm) high-power LED encapsulated with polystyrene resin by using optical coherent tomography (OCT). The displacement change between individual junctions of OCT image is directly observed and recorded to derive the CTE values of composed components of the LED device. The obtained instant CTE of polystyrene resin is estimated to be around 10 × 10−5/°C, which is a spatial average value over the OCT scanning area of 10 μm × 10 μm. The OCT provides an alternative way to determine a real-time, non-destructive, and spatially resolved CTE values of the LED device, and that shows essential advantage over the typical CTE measurement techniques.

AB - One of the most challenging issues when operating a high-power light-emitting diode (LED) is to conduct appropriate packaging materials for the reliable thermal management of the entire device. Generally, the considerable amount of heat produced around the junction area of the LED would transfers to the entire device, and causes thermal expansion in the packaging material. It induces strain inevitably, and hinders the output performances and possible applications of high-power LEDs. The coefficient of thermal expansion (CTE) is a physical quantity that indicates the expansion to which value a material will be upon heating. Therefore, as far as an advancement of thermal management is concerned, the quantitative and real-time determination of CTE of packaging materials becomes more important than ever since the demanding of high-power LEDs is increased in recent years. In this study, we measure the CTE of GaN-based (λ = 450 nm) high-power LED encapsulated with polystyrene resin by using optical coherent tomography (OCT). The displacement change between individual junctions of OCT image is directly observed and recorded to derive the CTE values of composed components of the LED device. The obtained instant CTE of polystyrene resin is estimated to be around 10 × 10−5/°C, which is a spatial average value over the OCT scanning area of 10 μm × 10 μm. The OCT provides an alternative way to determine a real-time, non-destructive, and spatially resolved CTE values of the LED device, and that shows essential advantage over the typical CTE measurement techniques.

KW - Light-emitting diodes

KW - Optical coherence tomography

KW - Packaging materials

UR - http://www.scopus.com/inward/record.url?scp=85026730485&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85026730485&partnerID=8YFLogxK

U2 - 10.1007/978-3-319-63856-0_18

DO - 10.1007/978-3-319-63856-0_18

M3 - Conference contribution

AN - SCOPUS:85026730485

SN - 9783319638553

T3 - Smart Innovation, Systems and Technologies

SP - 147

EP - 152

BT - Advances in Intelligent Information Hiding and Multimedia Signal Processing - Proceedings of the 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing,

A2 - Pan, Jeng-Shyang

A2 - Tsai, Pei-Wei

A2 - Jain, Lakhmi C.

A2 - Watada, Junzo

PB - Springer Science and Business Media Deutschland GmbH

ER -