Desorption of surfactant and sintering of surface modified Pd xNi1-x nanoparticles

Kuan Wen Wang, Shu Ru Chung, Wei Hsiu Hung, Tsong P. Perng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The desorption of surfactant and sintering of surface modified Pd xNi1-x nanoparticles are studied. The surface energy of the nanoparticles depends on the composition and is related to the desorption temperature of surfactant from the nanoparticle surface. For the alloys with higher Ni content, the surface energy is higher and the desorption temperature of surfactant is also higher. With the same composition, the desorption temperature of stearic acid (SA) is always higher than that of polyethylene glycol (PEG) because SA has a higher thermal resistance. After surface modification, the surface energy of the nanoparticles is changed. During heating, the more stable nanoparticles have less sintering and grain growth. Surface modification not only changes the surface energy of the nanoparticles but also prevents the nanoparticles from sintering. SA has better thermal resistance than PEG and shows better suppressing of sintering of the nanoparticles.

Original languageEnglish
Title of host publication2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
EditorsM. Laudon, B. Romanowicz
Pages402-405
Number of pages4
Volume3
Publication statusPublished - 2004 Nov 2
Event2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004 - Boston, MA, United States
Duration: 2004 Mar 72004 Mar 11

Other

Other2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
CountryUnited States
CityBoston, MA
Period04/3/704/3/11

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Keywords

  • Desorption
  • PdNi
  • Sintering
  • Surface modification
  • TPD

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Wang, K. W., Chung, S. R., Hung, W. H., & Perng, T. P. (2004). Desorption of surfactant and sintering of surface modified Pd xNi1-x nanoparticles. In M. Laudon, & B. Romanowicz (Eds.), 2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004 (Vol. 3, pp. 402-405)